626-15 Series
Manufacturer: Wakefield Thermal Solutions
HIGH EFFICIENCY HEAT SINK FOR VERTICAL BOARD MOUNTING POWER SEMICONDUCTOR T0218 &T0220 ROHS COMPLIANT: YES
| Part | Package Cooled | Width | Width [x] | Thermal Resistance @ Forced Air Flow | Material Finish | Power Dissipation @ Temperature Rise | Shape [custom] | Shape [custom] | Material | Attachment Method | Fin Height [z] | Fin Height [z] | Type | Length | Length |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Wakefield Thermal Solutions | TO-218 TO-220 TO-247 | 34.93 mm | 1.375 in | 5.5 °C/W | Black Anodized | 6 W | Rectangular | Fins | Aluminum | Bolt On PC Pin | 1.5 in | 38.1 mm | Board Level Vertical | 12.7 mm | 0.5 in |
Wakefield Thermal Solutions | TO-218 TO-220 TO-247 | 34.93 mm | 1.375 in | 5.5 °C/W | Black Anodized | 6 W | Rectangular | Fins | Aluminum | Bolt On PC Pin | 1.5 in | 38.1 mm | Board Level Vertical | 12.7 mm | 0.5 in |