23-0503 Series
Manufacturer: Aries Electronics
CONN SOCKET SIP 23POS GOLD
| Part | Termination Post Length | Termination Post Length | Material Flammability Rating | Current Rating (Amps) | Contact Material - Post [custom] | Pitch - Mating | Pitch - Mating | Contact Finish - Post | Pitch - Post | Pitch - Post | Termination | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Number of Positions or Pins (Grid) | Type | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Mounting Type | Contact Material - Mating | Housing Material | Contact Finish - Mating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | 0.5 in | 12.7 mm | UL94 HB | 3 A | Brass | 0.1 " | 2.54 mm | Gold | 0.1 in | 2.54 mm | Wire Wrap | 10 Áin | 0.25 çm | 23 | SIP | 0.76 Ám | 30 Áin | Through Hole | Beryllium Copper | Glass Filled Nylon Polyamide (PA) | Gold |
Aries Electronics | 0.36 in | 9.14 mm | UL94 HB | 3 A | Brass | 0.1 " | 2.54 mm | Tin | 0.1 in | 2.54 mm | Wire Wrap | 200 µin | 5.08 µm | 23 | SIP | 0.76 Ám | 30 Áin | Through Hole | Beryllium Copper | Glass Filled Nylon Polyamide (PA) | Gold |
Aries Electronics | 0.5 in | 12.7 mm | UL94 HB | 3 A | Brass | 0.1 " | 2.54 mm | Tin | 0.1 in | 2.54 mm | Wire Wrap | 200 µin | 5.08 µm | 23 | SIP | 0.76 Ám | 30 Áin | Through Hole | Beryllium Copper | Glass Filled Nylon Polyamide (PA) | Gold |
Aries Electronics | 0.36 in | 9.14 mm | UL94 HB | 3 A | Brass | 0.1 " | 2.54 mm | Gold | 0.1 in | 2.54 mm | Wire Wrap | 10 Áin | 0.25 çm | 23 | SIP | 0.76 Ám | 30 Áin | Through Hole | Beryllium Copper | Glass Filled Nylon Polyamide (PA) | Gold |