MMIX1T132N50P3 Series

Disc MSFT SMPD Pkg-HiPerFET&MSFT SMPD-B

Catalog

Disc MSFT SMPD Pkg-HiPerFET&MSFT SMPD-B

Part	Supplier Device Package	Mounting Type	Power Dissipation (Max)	Vgs(th) (Max) @ Id	Rds On (Max) @ Id, Vgs	Input Capacitance (Ciss) (Max) @ Vds	Drain to Source Voltage (Vdss)	Operating Temperature [Max]	Operating Temperature [Min]	Package / Case	FET Type	Technology	Vgs (Max)	Gate Charge (Qg) (Max) @ Vgs	Current - Continuous Drain (Id) @ 25°C	Drive Voltage (Max Rds On, Min Rds On)
LITTELFUSE MMIX1T132N50P3	Polar3™	Surface Mount	520 W	5 V	43 mOhm	18600 pF	500 V	150 °C	-55 °C	24-PowerSMD 22 Leads	N-Channel	MOSFET (Metal Oxide)	30 V	267 nC	63 A	10 V

Catalog

Disc MSFT SMPD Pkg-HiPerFET&MSFT SMPD-B

Description

Weighing only 8g, the SMPD package is much lighter (typically by 50%) than comparable conventional power modules, thereby enabling lower weight power systems. Due to its compact and ultra-low profile package, it is possible to use the same heat sink for multiple devices, saving PCB space. An added benefit of being smaller and lighter is that it provides better protection against vibrations and g-forces, especially if used in portable appliances, increasing the life expectancy and reliability of these devices. Configurations: Buck Boost Full-bridge Half-bridge Phase leg Single