658-35 Series

Catalog

HEAT SINK, SQUARE, FOR BALL GRID ARRAYS, PENGUIN COOLER, PIN FIN, BGA, 27.9 MM, 8.89 MM, 28 MM

Part	Type	Material	Material Finish	Width	Width [x]	Attachment Method	Length	Length	Fin Height [custom]	Fin Height [custom]	Package Cooled	Thermal Resistance @ Forced Air Flow	Shape
Wakefield Thermal Solutions 658-35ABT3	Top Mount	Aluminum	Black Anodized	27.94 mm	1.1 in	Thermal Tape Adhesive (Included)	27.94 mm	1.1 in	8.89 mm	0.35 "	BGA	3 °C/W	Pin Fins Square
Wakefield Thermal Solutions 658-35ABT3	Top Mount	Aluminum	Black Anodized	27.94 mm	1.1 in	Thermal Tape Adhesive (Included)	27.94 mm	1.1 in	8.89 mm	0.35 "	BGA	3 °C/W	Pin Fins Square
Wakefield Thermal Solutions 658-35AB	Top Mount	Aluminum	Black Anodized	27.94 mm	1.1 in	Thermal Tape Adhesive	27.94 mm	1.1 in	8.89 mm	0.35 "	BGA	3 °C/W	Pin Fins Square
Wakefield Thermal Solutions 658-35AB	Top Mount	Aluminum	Black Anodized	27.94 mm	1.1 in	Thermal Tape Adhesive	27.94 mm	1.1 in	8.89 mm	0.35 "	BGA	3 °C/W	Pin Fins Square