WAVE-35 Series

Catalog

LOW PROFILE HEAT SINK BGA CHIPSET ALUMINUM TOP MOUNT ROHS COMPLIANT: YES

Part	Attachment Method	Material	Shape [custom]	Shape [custom]	Length [x]	Length	Thermal Resistance @ Forced Air Flow	Package Cooled	Type	Width [y]	Width [y]	Material Finish	Fin Height	Fin Height	Fin Height [z]	Fin Height [z]
Wakefield Thermal Solutions WAVE-35-12	Clip	Aluminum Alloy	Angled Fins	Square	1.378 "	35 mm	3.83 °C/W	BGA	Board Level	1.378 "	35 mm	Black Anodized	0.472 in	12 mm
Wakefield Thermal Solutions WAVE-35-15	Clip	Aluminum Alloy	Angled Fins	Square	1.378 "	35 mm	3.15 °C/W	BGA	Board Level	1.378 "	35 mm	Black Anodized			15 mm	0.59 in
Wakefield Thermal Solutions WAVE-35-12	Clip	Aluminum Alloy	Angled Fins	Square	1.378 "	35 mm	3.83 °C/W	BGA	Board Level	1.378 "	35 mm	Black Anodized	0.472 in	12 mm
Wakefield Thermal Solutions WAVE-35-21	Clip	Aluminum Alloy	Angled Fins	Square	1.378 "	35 mm	2.11 °C/W	BGA	Board Level	1.378 "	35 mm	Black Anodized	0.827 "	21 mm
Wakefield Thermal Solutions WAVE-35-125	Clip	Aluminum Alloy	Angled Fins	Square	1.378 "	35 mm	3.63 °C/W	BGA	Board Level	1.378 "	35 mm	Black Anodized			12.5 mm	0.492 in
Wakefield Thermal Solutions WAVE-35-125	Clip	Aluminum Alloy	Angled Fins	Square	1.378 "	35 mm	3.63 °C/W	BGA	Board Level	1.378 "	35 mm	Black Anodized			12.5 mm	0.492 in
Wakefield Thermal Solutions WAVE-35-21	Clip	Aluminum Alloy	Angled Fins	Square	1.378 "	35 mm	2.11 °C/W	BGA	Board Level	1.378 "	35 mm	Black Anodized	0.827 "	21 mm
Wakefield Thermal Solutions WAVE-35-15	Clip	Aluminum Alloy	Angled Fins	Square	1.378 "	35 mm	3.15 °C/W	BGA	Board Level	1.378 "	35 mm	Black Anodized			15 mm	0.59 in