27-0518 Series
Manufacturer: Aries Electronics
Beta
⌘K
CONN SOCKET SIP 27POS GOLD
| Part | Current Rating (Amps) | Termination Post Length | Termination Post Length | Material Flammability Rating | Type | Housing Material | Termination | Pitch - Post | Pitch - Post | Contact Finish - Post | Number of Positions or Pins (Grid) [custom] | Number of Positions or Pins (Grid) | Pitch - Mating | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Features | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Material - Post [custom] | Mounting Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Aries Electronics | 3 A | 0.125 in | 3.18 mm | UL94 V-0 | SIP | Polyamide (PA46) Nylon 4/6 Glass Filled | Solder | 0.1 in | 2.54 mm | Tin | 1 x 27 | 27 | 0.1 " | 2.54 mm | Gold | 0.25 µm | 10 µin | Beryllium Copper | Open Frame | 200 µin | 5.08 µm | Brass | Through Hole |
Aries Electronics | 3 A | 0.046 in | 1.17 mm | UL94 V-0 | SIP | Polyamide (PA46) Nylon 4/6 Glass Filled | Solder | 0.1 in | 2.54 mm | Tin | 1 x 27 | 27 | 0.1 " | 2.54 mm | Gold | 0.25 µm | 10 µin | Beryllium Copper | Open Frame | 200 µin | 5.08 µm | Brass | Surface Mount |
Aries Electronics | 3 A | 0.125 in | 3.18 mm | UL94 V-0 | SIP | Polyamide (PA46) Nylon 4/6 Glass Filled | Solder | 0.1 in | 2.54 mm | Tin | 1 x 27 | 27 | 0.1 " | 2.54 mm | Gold | 0.25 µm | 10 µin | Beryllium Copper | Open Frame | 200 µin | 5.08 µm | Brass | Through Hole |
Aries Electronics | 3 A | 0.125 in | 3.18 mm | UL94 V-0 | SIP | Polyamide (PA46) Nylon 4/6 Glass Filled | Solder | 0.1 in | 2.54 mm | Gold | 1 x 27 | 27 | 0.1 " | 2.54 mm | Gold | 0.25 µm | 10 µin | Beryllium Copper | Open Frame | 10 Áin | 0.25 çm | Brass | Through Hole |