28-3508 Series

Catalog

CONN IC DIP SOCKET 28POS GOLD

Part	Current Rating (Amps)	Material Flammability Rating	Termination Post Length	Termination Post Length	Contact Finish - Post	Contact Material - Mating	Pitch - Post	Pitch - Post	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Operating Temperature [Min]	Operating Temperature [Max]	Pitch - Mating	Pitch - Mating	Contact Material - Post [custom]	Termination	Contact Finish - Mating	Type	Type	Type	Housing Material	Features	Number of Positions or Pins (Grid)	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Mounting Type
Aries Electronics 28-3508-302	3 A	UL94 V-0	9.14 mm	0.36 in	Tin	Beryllium Copper	0.1 in	2.54 mm	0.76 Ám	30 Áin	-55 C	105 ░C	0.1 "	2.54 mm	Brass	Wire Wrap	Gold	7.62 mm	0.3 in	DIP	Polyamide (PA46) Nylon 4/6 Glass Filled	Open Frame	28	200 µin	5.08 µm	Through Hole
Aries Electronics 28-3508-31	3 A	UL94 V-0	12.7 mm	0.5 in	Gold	Beryllium Copper	0.1 in	2.54 mm	0.76 Ám	30 Áin	-55 C	125 °C	0.1 "	2.54 mm	Brass	Wire Wrap	Gold	7.62 mm	0.3 in	DIP	Polyamide (PA46) Nylon 4/6 Glass Filled	Open Frame	28	10 Áin	0.25 çm	Through Hole
Aries Electronics 28-3508-21	3 A	UL94 V-0	12.7 mm	0.5 in	Gold	Beryllium Copper	0.1 in	2.54 mm	0.76 Ám	30 Áin	-55 C	125 °C	0.1 "	2.54 mm	Brass	Wire Wrap	Gold	7.62 mm	0.3 in	DIP	Polyamide (PA46) Nylon 4/6 Glass Filled	Open Frame	28	10 Áin	0.25 çm	Through Hole
Aries Electronics 28-3508-301	3 A	UL94 V-0	9.14 mm	0.36 in	Tin	Beryllium Copper	0.1 in	2.54 mm	0.76 Ám	30 Áin	-55 C	105 ░C	0.1 "	2.54 mm	Brass	Wire Wrap	Gold	7.62 mm	0.3 in	DIP	Polyamide (PA46) Nylon 4/6 Glass Filled	Open Frame	28	200 µin	5.08 µm	Through Hole
Aries Electronics 28-3508-311	3 A	UL94 V-0	12.7 mm	0.5 in	Gold	Beryllium Copper	0.1 in	2.54 mm	0.76 Ám	30 Áin	-55 C	125 °C	0.1 "	2.54 mm	Brass	Wire Wrap	Gold	7.62 mm	0.3 in	DIP	Polyamide (PA46) Nylon 4/6 Glass Filled	Open Frame	28	10 Áin	0.25 çm	Through Hole
Aries Electronics 28-3508-202	3 A	UL94 V-0	9.14 mm	0.36 in	Tin	Beryllium Copper	0.1 in	2.54 mm	0.76 Ám	30 Áin	-55 C	105 ░C	0.1 "	2.54 mm	Brass	Wire Wrap	Gold	7.62 mm	0.3 in	DIP	Polyamide (PA46) Nylon 4/6 Glass Filled	Open Frame	28	200 µin	5.08 µm	Through Hole
Aries Electronics 28-3508-312	3 A	UL94 V-0	12.7 mm	0.5 in	Gold	Beryllium Copper	0.1 in	2.54 mm	0.76 Ám	30 Áin	-55 C	125 °C	0.1 "	2.54 mm	Brass	Wire Wrap	Gold	7.62 mm	0.3 in	DIP	Polyamide (PA46) Nylon 4/6 Glass Filled	Open Frame	28	10 Áin	0.25 çm	Through Hole
Aries Electronics 28-3508-212	3 A	UL94 V-0	12.7 mm	0.5 in	Gold	Beryllium Copper	0.1 in	2.54 mm	0.76 Ám	30 Áin	-55 C	125 °C	0.1 "	2.54 mm	Brass	Wire Wrap	Gold	7.62 mm	0.3 in	DIP	Polyamide (PA46) Nylon 4/6 Glass Filled	Open Frame	28	10 Áin	0.25 çm	Through Hole