08-3511 Series
Manufacturer: Aries Electronics
Beta
⌘K
CONN IC DIP SOCKET 8POS GOLD
| Part | Current Rating (Amps) | Termination Post Length | Termination Post Length | Material Flammability Rating | Number of Positions or Pins (Grid) | Number of Positions or Pins (Grid) [x] | Number of Positions or Pins (Grid) [y] | Contact Material - Mating | Pitch - Mating | Pitch - Mating | Housing Material | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Termination | Contact Finish - Post | Contact Finish - Mating | Pitch - Post | Pitch - Post | Type | Type | Type | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Mounting Type | Features | Operating Temperature [Min] | Operating Temperature [Max] | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Aries Electronics | 1 A | 3.81 mm | 0.15 in | UL94 V-0 | 8 | 2 | 4 | Phosphor Bronze | 0.1 " | 2.54 mm | Polyamide (PA46) Nylon 4/6 Glass Filled | 0.25 µm | 10 µin | Solder | Gold | Gold | 0.1 in | 2.54 mm | 7.62 mm | 0.3 in | DIP | 10 Áin | 0.25 çm | Through Hole | Closed Frame | -55 C | 125 °C | Phosphor Bronze |
Aries Electronics | 1 A | 3.81 mm | 0.15 in | UL94 V-0 | 8 | 2 | 4 | Phosphor Bronze | 0.1 " | 2.54 mm | Polyamide (PA46) Nylon 4/6 Glass Filled | 5.08 µm | 200 µin | Solder | Tin | 0.1 in | 2.54 mm | 7.62 mm | 0.3 in | DIP | 200 µin | 5.08 µm | Through Hole | Closed Frame | -55 C | 105 ░C | Phosphor Bronze |