44-6551 Series

Catalog

CONN IC DIP SOCKET ZIF 44POS GLD

Part	Current Rating (Amps)	Termination Post Length	Termination Post Length	Material Flammability Rating	Contact Material - Mating	Pitch - Mating	Pitch - Mating	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid)	Housing Material	Contact Finish - Mating	Features	Contact Finish - Post	Pitch - Post	Pitch - Post	Contact Material - Post	Termination	Type	Type	Mounting Type	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Operating Temperature [Min]	Operating Temperature [Max]
Aries Electronics 44-6551-11	1 A	0.11 in	2.78 mm	UL94 V-0	Beryllium Copper	0.1 "	2.54 mm	2 22	44	Polyphenylene Sulfide (PPS) Glass Filled	Gold	Closed Frame	Gold	0.1 in	2.54 mm	Beryllium Copper	Solder	DIP ZIF (ZIP)	0.6 " (15.24mm) Row Spacing	Through Hole
Aries Electronics 44-6551-10	1 A	0.11 in	2.78 mm	UL94 V-0	Beryllium Copper	0.1 "	2.54 mm	2 22	44	Polyphenylene Sulfide (PPS) Glass Filled		Closed Frame	Tin	0.1 in	2.54 mm	Beryllium Copper	Solder	DIP ZIF (ZIP)	0.6 " (15.24mm) Row Spacing	Through Hole	5.08 µm	200 µin	200 µin	5.08 µm
Aries Electronics 44-6551-18	1 A	0.11 in	2.78 mm	UL94 V-0	Beryllium Nickel	0.1 "	2.54 mm	2 22	44	Polyetheretherketone (PEEK) Glass Filled	Nickel Boron	Closed Frame	Nickel Boron	0.1 in	2.54 mm	Beryllium Nickel	Solder	DIP ZIF (ZIP)	0.6 " (15.24mm) Row Spacing	Through Hole	1.27 µm	50 µin	50 µin	1.27 µm	-55 C	250 °C
Aries Electronics 44-6551-16	1 A	0.11 in	2.78 mm	UL94 V-0	Beryllium Copper	0.1 "	2.54 mm	2 22	44	Polyphenylene Sulfide (PPS) Glass Filled	Nickel Boron	Closed Frame	Nickel Boron	0.1 in	2.54 mm	Beryllium Copper	Solder	DIP ZIF (ZIP)	0.6 " (15.24mm) Row Spacing	Through Hole	1.27 µm	50 µin	50 µin	1.27 µm