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BM70 Series

Bluetooth Low Energy Module

Manufacturer: Microchip Technology

Catalog

Bluetooth Low Energy Module

Key Features

- Bluetooth 5 Certified
- Module certified for use in USA, Canada, Europe, Japan, Korea, Taiwan and China
- Mobile Application supported in Microchip Bluetooth Data (MBD)
- Latest Firmware Revision: 2.03 (BM70BLEx1FC2-0B05BA)
- Supports LE Secure Connections levels 1-3
- UART interface
- 3 x PWM supported
- Main Crystal : 32MHz
- Temperature sensor supported
- 12 bits ADC supported for 8CH input ports and battery voltage detection
- Wake up by any GPIO
- Average current: TX 3.87mA/RX 3.06mA with Buck,@ VBAT=3.0V and 18.75ms Connection Interval
- RSSI Monitor
- ISM Band 2.402 to 2.480 GHz operation
- Channels 0-39
- Rx Sensitivity: -90 dBm@ BLE, in typical
- Tx Power: +2 dBm
- RSSI monitor
- Ceramic Chip Antenna (BM70BLES1FC2)
- External Antenna Connection (BM70BLE01FC2)

Description

AI
The BM70 Bluetooth Low Energy module is designed for easy implementation into a broad range of applications. It delivers up to 2.5x throughput improvement and more secure connections vs. Bluetooth 4.1 based products. Developers can easily interface to the device via a standard UART interface, available on most Microcontrollers and Processors. The BM70 has a completely integrated Bluetooth software stack, and offers a shielded regulatory certified version with built-in antenna. Developers are freed from the complexities of Bluetooth Software and RF development and can simply utilize the BM70 as a wireline replacement. Perfect for IoT (Internet of Things) applications, when interfaced to a BLE enabled smartphone or Bluetooth Internet Gateway, applications can be monitored, controlled and updated from anywhere in the world. The Microchip Bluetooth Data (MBD) mobile app is available to speed up development for both [Android](https://play.google.com/store/apps/details?id=com.microchip.bluetooth.data) and [iOS](https://apps.apple.com/us/app/microchip-bluetooth-data/id1319166097). Microchip's complimentary and confidential [Wireless Check online design review service](https://www.microchip.com/en-us/support/design-help/design-check-services) is available for customers who have selected our products for their application design-in\*. \*The online design review service is subject to Microchip's [Program Terms and Conditions](https://www.microchip.com/en-us/support/design-help/design-check-services/design-check-services-program-terms-and-conditions) and requires a myMicrochip account. Looking for a chip level solution? Check out the IC solution here [IS1870](https://www.microchip.com/en-us/product/is1870) **Firmware Release Summary, see Software Release Notes for details:** FW 2.04 (online only) - fixed ANSII vulnerabilities and other bugs for IS1870, IS1871, BM70, BM71. BM70BLEx1FC2-0B05BA - FW 2.03 is a maintenance release for IS1870, IS1871, BM70, and BM71. Firmware version 2.0.3 adds new features/ removes limitations in previous release 1.11 and fixes Sweyntooth vulnerability. BM70BLEx1FC2-0B04AA - FW 1.11 - Fixes bug with invalid Bluetooth address. Refer to Errata document for more information. BM70BLEx1FC2-0B03AA - FW 1.06 - Added support for the [BM71](https://www.microchip.com/en-us/product/bm71) among other bug fixes. BM70BLEx1FC2-0002AA - FW 1.03 - Initial Release.