14-3518 Series

Catalog

CONN IC DIP SOCKET 14POS GOLD

Part	Termination Post Length	Termination Post Length	Material Flammability Rating	Current Rating (Amps)	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Termination	Features	Contact Finish - Post	Housing Material	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Pitch - Post	Pitch - Post	Number of Positions or Pins (Grid)	Type	Type	Type	Pitch - Mating	Pitch - Mating	Contact Finish - Mating	Contact Material - Post [custom]	Mounting Type	Contact Material - Mating
Aries Electronics 14-3518-10T	0.125 in	3.18 mm	UL94 V-0	3 A	0.25 µm	10 µin	Solder	Open Frame	Tin	Polyamide (PA46) Nylon 4/6 Glass Filled	200 µin	5.08 µm	0.1 in	2.54 mm	14	7.62 mm	0.3 in	DIP	0.1 "	2.54 mm	Gold	Brass	Through Hole	Beryllium Copper
Aries Electronics 14-3518-112	0.125 in	3.18 mm	UL94 V-0	3 A	0.25 µm	10 µin	Solder	Open Frame	Gold	Polyamide (PA46) Nylon 4/6 Glass Filled	10 Áin	0.25 çm	0.1 in	2.54 mm	14	7.62 mm	0.3 in	DIP	0.1 "	2.54 mm	Gold	Brass	Through Hole	Beryllium Copper
Aries Electronics 14-3518-10	0.125 in	3.18 mm	UL94 V-0	3 A	0.25 µm	10 µin	Solder	Open Frame	Tin	Polyamide (PA46) Nylon 4/6 Glass Filled	200 µin	5.08 µm	0.1 in	2.54 mm	14	7.62 mm	0.3 in	DIP	0.1 "	2.54 mm	Gold	Brass	Through Hole	Beryllium Copper
Aries Electronics 14-3518-101	0.125 in	3.18 mm	UL94 V-0	3 A	0.25 µm	10 µin	Solder	Open Frame	Tin	Polyamide (PA46) Nylon 4/6 Glass Filled	200 µin	5.08 µm	0.1 in	2.54 mm	14	7.62 mm	0.3 in	DIP	0.1 "	2.54 mm	Gold	Brass	Through Hole	Beryllium Copper
Aries Electronics 14-3518-111	0.125 in	3.18 mm	UL94 V-0	3 A	0.25 µm	10 µin	Solder	Open Frame	Gold	Polyamide (PA46) Nylon 4/6 Glass Filled	10 Áin	0.25 çm	0.1 in	2.54 mm	14	7.62 mm	0.3 in	DIP	0.1 "	2.54 mm	Gold	Brass	Through Hole	Beryllium Copper
Aries Electronics 14-3518-01	0.125 in	3.18 mm	UL94 V-0	3 A	0.25 µm	10 µin	Solder	Open Frame	Tin	Polyamide (PA46) Nylon 4/6 Glass Filled	200 µin	5.08 µm	0.1 in	2.54 mm	14	7.62 mm	0.3 in	DIP	0.1 "	2.54 mm	Gold	Brass	Through Hole	Beryllium Copper
Aries Electronics 14-3518-00	0.125 in	3.18 mm	UL94 V-0	3 A	0.25 µm	10 µin	Solder	Open Frame	Tin	Polyamide (PA46) Nylon 4/6 Glass Filled	200 µin	5.08 µm	0.1 in	2.54 mm	14	7.62 mm	0.3 in	DIP	0.1 "	2.54 mm	Gold	Brass	Surface Mount	Beryllium Copper
Aries Electronics 14-3518-101H	0.125 in	3.18 mm	UL94 V-0	3 A	0.25 µm	10 µin	Solder	Open Frame	Tin	Polyamide (PA46) Nylon 4/6 Glass Filled	200 µin	5.08 µm	0.1 in	2.54 mm	14	7.62 mm	0.3 in	DIP	0.1 "	2.54 mm	Gold	Brass	Through Hole	Beryllium Copper
Aries Electronics 14-3518-102	0.125 in	3.18 mm	UL94 V-0	3 A	0.25 µm	10 µin	Solder	Open Frame	Tin	Polyamide (PA46) Nylon 4/6 Glass Filled	200 µin	5.08 µm	0.1 in	2.54 mm	14	7.62 mm	0.3 in	DIP	0.1 "	2.54 mm	Gold	Brass	Through Hole	Beryllium Copper
Aries Electronics 14-3518-10M	0.125 in	3.18 mm	UL94 V-0	3 A	0.25 µm	10 µin	Solder	Open Frame	Tin	Polyamide (PA46) Nylon 4/6 Glass Filled	200 µin	5.08 µm	0.1 in	2.54 mm	14	7.62 mm	0.3 in	DIP	0.1 "	2.54 mm	Gold	Brass	Through Hole	Beryllium Copper