32-6551 Series

Catalog

CONN IC DIP SOCKET ZIF 32POS TIN

Part	Current Rating (Amps)	Material Flammability Rating	Termination Post Length	Termination Post Length	Number of Positions or Pins (Grid)	Termination	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Material - Post	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Housing Material	Pitch - Post	Pitch - Post	Contact Finish - Post	Pitch - Mating	Pitch - Mating	Type	Type	Mounting Type	Features	Contact Material - Mating	Contact Finish - Mating	Operating Temperature [Min]	Operating Temperature [Max]
Aries Electronics 32-6551-10	1 A	UL94 V-0	0.11 in	2.78 mm	32	Solder	5.08 µm	200 µin	Beryllium Copper	200 µin	5.08 µm	Polyphenylene Sulfide (PPS) Glass Filled	0.1 in	2.54 mm	Tin	0.1 "	2.54 mm	DIP ZIF (ZIP)	0.6 " (15.24mm) Row Spacing	Through Hole	Closed Frame	Beryllium Copper
Aries Electronics 32-6551-11	1 A	UL94 V-0	0.11 in	2.78 mm	32	Solder			Beryllium Copper			Polyphenylene Sulfide (PPS) Glass Filled	0.1 in	2.54 mm	Gold	0.1 "	2.54 mm	DIP ZIF (ZIP)	0.6 " (15.24mm) Row Spacing	Through Hole	Closed Frame	Beryllium Copper	Gold
Aries Electronics 32-6551-16	1 A	UL94 V-0	0.11 in	2.78 mm	32	Solder	1.27 µm	50 µin	Beryllium Copper	50 µin	1.27 µm	Polyphenylene Sulfide (PPS) Glass Filled	0.1 in	2.54 mm	Nickel Boron	0.1 "	2.54 mm	DIP ZIF (ZIP)	0.6 " (15.24mm) Row Spacing	Through Hole	Closed Frame	Beryllium Copper	Nickel Boron
Aries Electronics 32-6551-18	1 A	UL94 V-0	0.11 in	2.78 mm	32	Solder	1.27 µm	50 µin	Beryllium Nickel	50 µin	1.27 µm	Polyetheretherketone (PEEK) Glass Filled	0.1 in	2.54 mm	Nickel Boron	0.1 "	2.54 mm	DIP ZIF (ZIP)	0.6 " (15.24mm) Row Spacing	Through Hole	Closed Frame	Beryllium Nickel	Nickel Boron	-55 C	250 °C