32-6573 Series

Catalog

CONN IC DIP SOCKET ZIF 32POS TIN

Part	Current Rating (Amps)	Termination Post Length	Termination Post Length	Material Flammability Rating	Housing Material	Type	Type	Mounting Type	Pitch - Post	Pitch - Post	Number of Positions or Pins (Grid)	Termination	Contact Finish - Post	Contact Material - Post	Pitch - Mating	Pitch - Mating	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Features	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Material - Mating
Aries Electronics 32-6573-16	1 A	0.11 in	2.78 mm	UL94 V-0	Polyphenylene Sulfide (PPS) Glass Filled	DIP ZIF (ZIP)	0.6 " (15.24mm) Row Spacing	Through Hole	0.1 in	2.54 mm	32	Solder	Tin	Beryllium Copper	0.1 "	2.54 mm	5.08 µm	200 µin	Closed Frame	200 µin	5.08 µm	Beryllium Copper
Aries Electronics 32-6573-10	1 A	0.11 in	2.78 mm	UL94 V-0	Polyphenylene Sulfide (PPS) Glass Filled	DIP ZIF (ZIP)	0.6 " (15.24mm) Row Spacing	Through Hole	0.1 in	2.54 mm	32	Solder	Tin	Beryllium Copper	0.1 "	2.54 mm	5.08 µm	200 µin	Closed Frame	200 µin	5.08 µm	Beryllium Copper
Aries Electronics 32-6573-11	1 A	0.11 in	2.78 mm	UL94 V-0	Polyphenylene Sulfide (PPS) Glass Filled	DIP ZIF (ZIP)	0.6 " (15.24mm) Row Spacing	Through Hole	0.1 in	2.54 mm	32	Solder	Tin	Beryllium Copper	0.1 "	2.54 mm	5.08 µm	200 µin	Closed Frame	200 µin	5.08 µm	Beryllium Copper