08-1508 Series
Manufacturer: Aries Electronics
Beta
⌘K
CONN IC DIP SOCKET 8POS GOLD
| Part | Current Rating (Amps) | Material Flammability Rating | Termination Post Length | Termination Post Length | Type | Type | Contact Finish - Post | Termination | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Contact Finish - Mating | Number of Positions or Pins (Grid) | Number of Positions or Pins (Grid) [x] | Number of Positions or Pins (Grid) [y] | Pitch - Post | Pitch - Post | Operating Temperature [Min] | Operating Temperature [Max] | Mounting Type | Contact Material - Mating | Housing Material | Pitch - Mating | Pitch - Mating | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Material - Post [custom] | Features |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Aries Electronics | 3 A | UL94 V-0 | 0.5 in | 12.7 mm | DIP | 5.08 mm | Tin | Wire Wrap | 0.25 µm | 10 µin | Gold | 8 | 2 | 4 | 0.1 in | 2.54 mm | -55 C | 105 ░C | Through Hole | Beryllium Copper | Polyamide (PA46) Nylon 4/6 | 0.1 " | 2.54 mm | 200 µin | 5.08 µm | Brass | Closed Frame |
Aries Electronics | 3 A | UL94 V-0 | 0.36 in | 9.14 mm | DIP | 5.08 mm | Gold | Wire Wrap | 0.25 µm | 10 µin | Gold | 8 | 2 | 4 | 0.1 in | 2.54 mm | -55 C | 125 °C | Through Hole | Beryllium Copper | Polyamide (PA46) Nylon 4/6 | 0.1 " | 2.54 mm | 10 Áin | 0.25 çm | Brass | Closed Frame |