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SN74LVC2G38

SN74LVC2G38 Series

2-ch, 2-input, 1.65-V to 5.5-V NAND gates with open-drain outputs

Manufacturer: Texas Instruments

Catalog

2-ch, 2-input, 1.65-V to 5.5-V NAND gates with open-drain outputs

Key Features

Available in the Texas Instruments NanoFree PackageSupports 5-V VCCOperationInputs Accept Voltages to 5.5 VMax tpdof 4 ns at 3.3 VLow Power Consumption, 10-μA Max ICC±24-mA Output Drive at 3.3 VTypical VOLP(Output Ground Bounce) <0.8 V at VCC= 3.3 V, TA= 25°CTypical VOHV(Output VOHUndershoot)>2 V at VCC= 3.3 V, TA= 25°CIoffSupports Live insertion, Partial-Power-Down Mode Operation and Back Drive ProtectionLatch-Up Performance Exceeds 100 mA Per JESD 78, Class IIESD Protection Exceeds JESD 222000-V Human-Body Model (A114-A)200-V Machine Model (A115-A)1000-V Charged-Device Model (C101)Available in the Texas Instruments NanoFree PackageSupports 5-V VCCOperationInputs Accept Voltages to 5.5 VMax tpdof 4 ns at 3.3 VLow Power Consumption, 10-μA Max ICC±24-mA Output Drive at 3.3 VTypical VOLP(Output Ground Bounce) <0.8 V at VCC= 3.3 V, TA= 25°CTypical VOHV(Output VOHUndershoot)>2 V at VCC= 3.3 V, TA= 25°CIoffSupports Live insertion, Partial-Power-Down Mode Operation and Back Drive ProtectionLatch-Up Performance Exceeds 100 mA Per JESD 78, Class IIESD Protection Exceeds JESD 222000-V Human-Body Model (A114-A)200-V Machine Model (A115-A)1000-V Charged-Device Model (C101)

Description

AI
The SN74LVC2G38 is designed for 1.65-V to 5.5-V VCCoperation. This device is a dual two-input NAND buffer gate with open-drain outputs. It performs the Boolean function Y =A • Bor Y =A+Bin positive logic. NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package. This device is fully specified for partial-power-down applications using Ioff. The Ioffcircuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. The SN74LVC2G38 is designed for 1.65-V to 5.5-V VCCoperation. This device is a dual two-input NAND buffer gate with open-drain outputs. It performs the Boolean function Y =A • Bor Y =A+Bin positive logic. NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package. This device is fully specified for partial-power-down applications using Ioff. The Ioffcircuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.