38-3503 Series

Catalog

CONN IC DIP SOCKET 38POS GOLD

Part	Termination Post Length	Termination Post Length	Current Rating (Amps)	Material Flammability Rating	Contact Finish - Mating	Type	Type	Type	Contact Material - Post	Features	Termination	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Finish - Post	Number of Positions or Pins (Grid)	Mounting Type	Operating Temperature [Min]	Operating Temperature [Max]	Pitch - Post	Pitch - Post	Pitch - Mating	Pitch - Mating	Housing Material	Contact Material - Mating
Aries Electronics 38-3503-31	0.5 in	12.7 mm	3 A	UL94 V-0	Gold	7.62 mm	0.3 in	DIP	Phosphor Bronze	Closed Frame	Wire Wrap	0.25 µm	10 µin	10 Áin	0.25 çm	Gold	38	Through Hole	-55 C	125 °C	0.1 in	2.54 mm	0.1 "	2.54 mm	Polyamide (PA46) Nylon 4/6 Glass Filled	Beryllium Copper
Aries Electronics 38-3503-30	0.5 in	12.7 mm	3 A	UL94 V-0	Gold	7.62 mm	0.3 in	DIP	Phosphor Bronze	Closed Frame	Wire Wrap	0.25 µm	10 µin	200 µin	5.08 µm	Tin	38	Through Hole	-55 C	105 ░C	0.1 in	2.54 mm	0.1 "	2.54 mm	Polyamide (PA46) Nylon 4/6 Glass Filled	Beryllium Copper
Aries Electronics 38-3503-20	0.36 in	9.14 mm	3 A	UL94 V-0	Gold	7.62 mm	0.3 in	DIP	Phosphor Bronze	Closed Frame	Wire Wrap	0.25 µm	10 µin	200 µin	5.08 µm	Tin	38	Through Hole	-55 C	105 ░C	0.1 in	2.54 mm	0.1 "	2.54 mm	Polyamide (PA46) Nylon 4/6 Glass Filled	Beryllium Copper
Aries Electronics 38-3503-21	0.36 in	9.14 mm	3 A	UL94 V-0	Gold	7.62 mm	0.3 in	DIP	Phosphor Bronze	Closed Frame	Wire Wrap	0.25 µm	10 µin	10 Áin	0.25 çm	Gold	38	Through Hole	-55 C	125 °C	0.1 in	2.54 mm	0.1 "	2.54 mm	Polyamide (PA46) Nylon 4/6 Glass Filled	Beryllium Copper