22-0518 Series
Manufacturer: Aries Electronics
CONN SOCKET SIP 22POS GOLD
| Part | Termination Post Length | Termination Post Length | Current Rating (Amps) | Material Flammability Rating | Contact Finish - Mating | Pitch - Post | Pitch - Post | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Mounting Type | Contact Material - Mating | Pitch - Mating | Pitch - Mating | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Features | Type | Contact Finish - Post | Number of Positions or Pins (Grid) | Termination | Housing Material | Contact Material - Post [custom] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | 1.17 mm | 0.046 in | 3 A | UL94 V-0 | Gold | 0.1 in | 2.54 mm | 0.25 µm | 10 µin | Surface Mount | Beryllium Copper | 0.1 " | 2.54 mm | 200 µin | 5.08 µm | Open Frame | SIP | Tin | 22 | Solder | Polyamide (PA46) Nylon 4/6 Glass Filled | Brass |
Aries Electronics | 3.18 mm | 0.125 in | 3 A | UL94 V-0 | Gold | 0.1 in | 2.54 mm | 0.25 µm | 10 µin | Through Hole | Beryllium Copper | 0.1 " | 2.54 mm | 200 µin | 5.08 µm | Open Frame | SIP | Tin | 22 | Solder | Polyamide (PA46) Nylon 4/6 Glass Filled | Brass |
Aries Electronics | 3.18 mm | 0.125 in | 3 A | UL94 V-0 | Gold | 0.1 in | 2.54 mm | 0.25 µm | 10 µin | Through Hole | Beryllium Copper | 0.1 " | 2.54 mm | 200 µin | 5.08 µm | Open Frame | SIP | Tin | 22 | Solder | Polyamide (PA46) Nylon 4/6 Glass Filled | Brass |
Aries Electronics | 3.18 mm | 0.125 in | 3 A | UL94 V-0 | Gold | 0.1 in | 2.54 mm | 0.25 µm | 10 µin | Through Hole | Beryllium Copper | 0.1 " | 2.54 mm | 10 Áin | 0.25 çm | Open Frame | SIP | Gold | 22 | Solder | Polyamide (PA46) Nylon 4/6 Glass Filled | Brass |