08-4513 Series

Catalog

CONN IC DIP SOCKET 8POS GOLD

Part	Current Rating (Amps)	Material Flammability Rating	Termination Post Length	Termination Post Length	Mounting Type	Contact Material - Mating	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Operating Temperature [Min]	Operating Temperature [Max]	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Type	Type	Number of Positions or Pins (Grid)	Number of Positions or Pins (Grid) [x]	Number of Positions or Pins (Grid) [y]	Contact Material - Post [custom]	Contact Finish - Mating	Termination	Contact Finish - Post	Housing Material	Features	Pitch - Mating	Pitch - Mating	Pitch - Post	Pitch - Post
Aries Electronics 08-4513-11	3 A	UL94 V-0	0.125 in	3.18 mm	Through Hole	Beryllium Copper	10 Áin	0.25 çm	-55 C	105 ░C	0.25 µm	10 µin	0.4 in	DIP	8	2	4	Brass	Gold	Solder	Gold	Polyamide (PA46) Nylon 4/6 Glass Filled	Closed Frame	0.1 "	2.54 mm	0.1 in	2.54 mm
Aries Electronics 08-4513-11H	3 A	UL94 V-0	0.125 in	3.18 mm	Through Hole	Beryllium Copper	10 Áin	0.25 çm	-55 C	105 ░C	0.25 µm	10 µin	0.4 in	DIP	8	2	4	Brass	Gold	Solder	Gold	Polyamide (PA46) Nylon 4/6 Glass Filled	Closed Frame	0.1 "	2.54 mm	0.1 in	2.54 mm
Aries Electronics 08-4513-10T	3 A	UL94 V-0	0.125 in	3.18 mm	Through Hole	Beryllium Copper	200 µin	5.08 µm	-55 C	105 ░C	0.25 µm	10 µin	0.4 in	DIP	8	2	4	Brass	Gold	Solder	Tin	Polyamide (PA46) Nylon 4/6 Glass Filled	Closed Frame	0.1 "	2.54 mm	0.1 in	2.54 mm