06-3503 Series

Catalog

CONN IC DIP SOCKET 6POS GOLD

Part	Material Flammability Rating	Termination Post Length	Termination Post Length	Current Rating (Amps)	Features	Contact Material - Post	Number of Positions or Pins (Grid) [y]	Number of Positions or Pins (Grid) [x]	Number of Positions or Pins (Grid)	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Finish - Post	Pitch - Post	Pitch - Post	Operating Temperature [Min]	Operating Temperature [Max]	Type	Type	Type	Contact Finish - Mating	Pitch - Mating	Pitch - Mating	Mounting Type	Housing Material	Termination
Aries Electronics 06-3503-21	UL94 V-0	9.14 mm	0.36 in	3 A	Closed Frame	Phosphor Bronze	3 positions or pins	2	6	0.25 µm	10 µin	Beryllium Copper	10 Áin	0.25 çm	Gold	0.1 in	2.54 mm	-55 C	125 °C	7.62 mm	0.3 in	DIP	Gold	0.1 "	2.54 mm	Through Hole	Polyamide (PA46) Nylon 4/6 Glass Filled	Wire Wrap
Aries Electronics 06-3503-20	UL94 V-0	9.14 mm	0.36 in	3 A	Closed Frame	Phosphor Bronze	3 positions or pins	2	6	0.25 µm	10 µin	Beryllium Copper	200 µin	5.08 µm	Tin	0.1 in	2.54 mm	-55 C	105 ░C	7.62 mm	0.3 in	DIP	Gold	0.1 "	2.54 mm	Through Hole	Polyamide (PA46) Nylon 4/6 Glass Filled	Wire Wrap
Aries Electronics 06-3503-30	UL94 V-0	12.7 mm	0.5 in	3 A	Closed Frame	Phosphor Bronze	3 positions or pins	2	6	0.25 µm	10 µin	Beryllium Copper	200 µin	5.08 µm	Tin	0.1 in	2.54 mm	-55 C	105 ░C	7.62 mm	0.3 in	DIP	Gold	0.1 "	2.54 mm	Through Hole	Polyamide (PA46) Nylon 4/6 Glass Filled	Wire Wrap
Aries Electronics 06-3503-31	UL94 V-0	12.7 mm	0.5 in	3 A	Closed Frame	Phosphor Bronze	3 positions or pins	2	6	0.25 µm	10 µin	Beryllium Copper	10 Áin	0.25 çm	Gold	0.1 in	2.54 mm	-55 C	125 °C	7.62 mm	0.3 in	DIP	Gold	0.1 "	2.54 mm	Through Hole	Polyamide (PA46) Nylon 4/6 Glass Filled	Wire Wrap