28-6553 Series
Manufacturer: Aries Electronics
Beta
⌘K
CONN IC DIP SOCKET ZIF 28POS
| Part | Current Rating (Amps) | Termination Post Length | Termination Post Length | Material Flammability Rating | Termination | Housing Material | Contact Finish - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Features | Contact Material - Post | Mounting Type | Pitch - Mating | Pitch - Mating | Pitch - Post | Pitch - Post | Type | Type | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Aries Electronics | 1 A | 0.11 in | 2.78 mm | UL94 V-0 | Solder | Polyphenylene Sulfide (PPS) Glass Filled | Nickel Boron | Nickel Boron | 28 | Beryllium Copper | 1.27 µm | 50 µin | Closed Frame | Beryllium Copper | Through Hole | 0.1 " | 2.54 mm | 0.1 in | 2.54 mm | DIP ZIF (ZIP) | 0.6 " (15.24mm) Row Spacing | 50 µin | 1.27 µm |
Aries Electronics | 1 A | 0.11 in | 2.78 mm | UL94 V-0 | Solder | Polyphenylene Sulfide (PPS) Glass Filled | Gold | Gold | 28 | Beryllium Copper | Closed Frame | Beryllium Copper | Through Hole | 0.1 " | 2.54 mm | 0.1 in | 2.54 mm | DIP ZIF (ZIP) | 0.6 " (15.24mm) Row Spacing | ||||
Aries Electronics | 1 A | 0.11 in | 2.78 mm | UL94 V-0 | Solder | Polyphenylene Sulfide (PPS) Glass Filled | Tin | 32 | Beryllium Copper | 5.08 µm | 200 µin | Closed Frame | Beryllium Copper | Through Hole | 0.1 " | 2.54 mm | 0.1 in | 2.54 mm | DIP ZIF (ZIP) | 0.6 " (15.24mm) Row Spacing | 200 µin | 5.08 µm |