44-3551 Series

Catalog

CONN IC DIP SOCKET ZIF 44POS

Part	Termination Post Length	Termination Post Length	Current Rating (Amps)	Material Flammability Rating	Pitch - Mating	Pitch - Mating	Termination	Contact Finish - Mating	Contact Material - Post	Contact Material - Mating	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Features	Type	Type	Type	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid)	Mounting Type	Pitch - Post	Pitch - Post	Contact Finish - Post	Housing Material	Operating Temperature [Min]	Operating Temperature [Max]
Aries Electronics 44-3551-16	0.11 in	2.78 mm	1 A	UL94 V-0	0.1 "	2.54 mm	Solder	Nickel Boron	Beryllium Copper	Beryllium Copper	50 µin	1.27 µm	1.27 µm	50 µin	Closed Frame	DIP ZIF (ZIP)	7.62 mm	0.3 in	2 22	44	Through Hole	0.1 in	2.54 mm	Nickel Boron	Polyphenylene Sulfide (PPS) Glass Filled
Aries Electronics 44-3551-18	0.11 in	2.78 mm	1 A	UL94 V-0	0.1 "	2.54 mm	Solder	Nickel Boron	Beryllium Nickel	Beryllium Nickel	50 µin	1.27 µm	1.27 µm	50 µin	Closed Frame	DIP ZIF (ZIP)	7.62 mm	0.3 in	2 22	44	Through Hole	0.1 in	2.54 mm	Nickel Boron	Polyetheretherketone (PEEK) Glass Filled	-55 C	250 °C
Aries Electronics 44-3551-10	0.11 in	2.78 mm	1 A	UL94 V-0	0.1 "	2.54 mm	Solder		Beryllium Copper	Beryllium Copper	200 µin	5.08 µm	5.08 µm	200 µin	Closed Frame	DIP ZIF (ZIP)	7.62 mm	0.3 in	2 22	44	Through Hole	0.1 in	2.54 mm	Tin	Polyphenylene Sulfide (PPS) Glass Filled
Aries Electronics 44-3551-11	0.11 in	2.78 mm	1 A	UL94 V-0	0.1 "	2.54 mm	Solder	Gold	Beryllium Copper	Beryllium Copper					Closed Frame	DIP ZIF (ZIP)	7.62 mm	0.3 in	2 22	44	Through Hole	0.1 in	2.54 mm	Gold	Polyphenylene Sulfide (PPS) Glass Filled