14-8870 Series
Manufacturer: Aries Electronics
Beta
⌘K
CONN IC DIP SOCKET 14POS TIN
| Part | Current Rating (Amps) | Termination Post Length | Termination Post Length | Material Flammability Rating | Contact Finish - Post | Pitch - Post | Pitch - Post | Housing Material | Pitch - Mating | Pitch - Mating | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Termination | Type | Type | Type | Contact Material - Post | Number of Positions or Pins (Grid) | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Material - Mating | Features | Operating Temperature [Min] | Operating Temperature [Max] | Mounting Type | Contact Finish - Mating | Contact Material - Post [custom] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Aries Electronics | 1 A | 3.56 mm | 0.14 in | UL94 V-0 | Tin | 0.1 in | 2.54 mm | Polyamide (PA46) Nylon 4/6 Glass Filled | 0.1 " | 2.54 mm | 5.08 µm | 200 µin | Solder | 7.62 mm | 0.3 in | DIP | Phosphor Bronze | 14 | 200 µin | 5.08 µm | Phosphor Bronze | Closed Frame Elevated | -55 C | 105 ░C | Through Hole | ||
Aries Electronics | 3 A | 3.56 mm | 0.14 in | UL94 V-0 | Gold | 0.1 in | 2.54 mm | Polyamide (PA46) Nylon 4/6 Glass Filled | 0.1 " | 2.54 mm | 0.76 Ám | 30 Áin | Solder | 7.62 mm | 0.3 in | DIP | 14 | 10 Áin | 0.25 çm | Beryllium Copper | Closed Frame Elevated | -55 C | 105 ░C | Through Hole | Gold | Brass |