30-1518 Series

Catalog

CONN IC DIP SOCKET 30POS GOLD

Part	Material Flammability Rating	Current Rating (Amps)	Termination Post Length	Termination Post Length	Termination	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Pitch - Post	Pitch - Post	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Finish - Post	Housing Material	Contact Material - Mating	Type	Type	Mounting Type	Pitch - Mating	Pitch - Mating	Features	Number of Positions or Pins (Grid)	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]	Contact Material - Post [custom]
Aries Electronics 30-1518-10T	UL94 V-0	3 A	0.125 in	3.18 mm	Solder	200 µin	5.08 µm	0.1 in	2.54 mm	Gold	0.25 µm	10 µin	Tin	Polyamide (PA46) Nylon 4/6 Glass Filled	Beryllium Copper	DIP	5.08 mm	Through Hole	0.1 "	2.54 mm	Open Frame	30	15	2	Brass
Aries Electronics 30-1518-10H	UL94 V-0	3 A	0.125 in	3.18 mm	Solder	200 µin	5.08 µm	0.1 in	2.54 mm	Gold	0.25 µm	10 µin	Tin	Polyamide (PA46) Nylon 4/6 Glass Filled	Beryllium Copper	DIP	5.08 mm	Through Hole	0.1 "	2.54 mm	Open Frame	30	15	2	Brass
Aries Electronics 30-1518-10	UL94 V-0	3 A	0.125 in	3.18 mm	Solder	200 µin	5.08 µm	0.1 in	2.54 mm	Gold	0.25 µm	10 µin	Tin	Polyamide (PA46) Nylon 4/6 Glass Filled	Beryllium Copper	DIP	5.08 mm	Through Hole	0.1 "	2.54 mm	Open Frame	30	15	2	Brass
Aries Electronics 30-1518-00	UL94 V-0	3 A	0.125 in	3.18 mm	Solder	200 µin	5.08 µm	0.1 in	2.54 mm	Gold	0.25 µm	10 µin	Tin	Polyamide (PA46) Nylon 4/6 Glass Filled	Beryllium Copper	DIP	5.08 mm	Surface Mount	0.1 "	2.54 mm	Open Frame	30	15	2	Brass