
Catalog
Single 3-input, 1.65-V to 5.5-V NAND gate
Key Features
• Available in the Texas Instruments NanoFree PackageSupports 5-V VCCOperationInputs Accept Voltages to 5.5 VProvides Down Translation to VCCMax tpdof 3.8 ns at 3.3 VLow Power Consumption, 10-μA Max ICC±24-mA Output Drive at 3.3 VIoffSupports Live Insertion, Partial-Power-Down Mode, and Back Drive ProtectionLatch-Up Performance Exceeds 100 mA per JESD 78, Class IIESD Protection Exceeds JESD 222000-V Human-Body Model (A114-A)200-V Machine Model (A115-A)1000-V Charged Device Model (C101)Available in the Texas Instruments NanoFree PackageSupports 5-V VCCOperationInputs Accept Voltages to 5.5 VProvides Down Translation to VCCMax tpdof 3.8 ns at 3.3 VLow Power Consumption, 10-μA Max ICC±24-mA Output Drive at 3.3 VIoffSupports Live Insertion, Partial-Power-Down Mode, and Back Drive ProtectionLatch-Up Performance Exceeds 100 mA per JESD 78, Class IIESD Protection Exceeds JESD 222000-V Human-Body Model (A114-A)200-V Machine Model (A115-A)1000-V Charged Device Model (C101)
Description
AI
The SN74LVC1G10 performs the Boolean function Y =A • B • Cor Y =A+B+Cin positive logic.
NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.
This device is fully specified for partial-power-down applications using Ioff. The Ioffcircuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.
The SN74LVC1G10 performs the Boolean function Y =A • B • Cor Y =A+B+Cin positive logic.
NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.
This device is fully specified for partial-power-down applications using Ioff. The Ioffcircuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.