42-3574 Series

Catalog

CONN IC DIP SOCKET ZIF 42POS TIN

Part	Material Flammability Rating	Termination Post Length	Termination Post Length	Current Rating (Amps)	Number of Positions or Pins (Grid)	Contact Material - Mating	Mounting Type	Contact Material - Post	Pitch - Mating	Pitch - Mating	Type	Type	Type	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Finish - Post	Features	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Housing Material	Termination	Pitch - Post	Pitch - Post
Aries Electronics 42-3574-10	UL94 V-0	0.11 in	2.78 mm	1 A	42	Beryllium Copper	Through Hole	Beryllium Copper	0.1 "	2.54 mm	DIP ZIF (ZIP)	7.62 mm	0.3 in	200 µin	5.08 µm	Tin	Closed Frame	5.08 µm	200 µin	Polyphenylene Sulfide (PPS) Glass Filled	Solder	0.1 in	2.54 mm
Aries Electronics 42-3574-16	UL94 V-0	0.11 in	2.78 mm	1 A	42	Beryllium Copper	Through Hole	Beryllium Copper	0.1 "	2.54 mm	DIP ZIF (ZIP)	7.62 mm	0.3 in	200 µin	5.08 µm	Tin	Closed Frame	5.08 µm	200 µin	Polyphenylene Sulfide (PPS) Glass Filled	Solder	0.1 in	2.54 mm
Aries Electronics 42-3574-18	UL94 V-0	0.11 in	2.78 mm	1 A	42	Beryllium Copper	Through Hole	Beryllium Copper	0.1 "	2.54 mm	DIP ZIF (ZIP)	7.62 mm	0.3 in	200 µin	5.08 µm	Tin	Closed Frame	5.08 µm	200 µin	Polyphenylene Sulfide (PPS) Glass Filled	Solder	0.1 in	2.54 mm
Aries Electronics 42-3574-11	UL94 V-0	0.11 in	2.78 mm	1 A	42	Beryllium Copper	Through Hole	Beryllium Copper	0.1 "	2.54 mm	DIP ZIF (ZIP)	7.62 mm	0.3 in	200 µin	5.08 µm	Tin	Closed Frame	5.08 µm	200 µin	Polyphenylene Sulfide (PPS) Glass Filled	Solder	0.1 in	2.54 mm