48-3573 Series
Manufacturer: Aries Electronics
Beta
⌘K
CONN IC DIP SOCKET ZIF 48POS GLD
| Part | Termination Post Length | Termination Post Length | Current Rating (Amps) | Material Flammability Rating | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Pitch - Post | Pitch - Post | Features | Contact Material - Mating | Termination | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Type | Type | Type | Housing Material | Contact Finish - Mating | Number of Positions or Pins (Grid) [y] | Number of Positions or Pins (Grid) [custom] | Number of Positions or Pins (Grid) [x] | Pitch - Mating | Pitch - Mating | Contact Material - Post | Mounting Type | Contact Finish - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Aries Electronics | 0.11 in | 2.78 mm | 1 A | UL94 V-0 | 10 Áin | 0.25 çm | 0.1 in | 2.54 mm | Closed Frame | Beryllium Copper | Solder | 0.25 µm | 10 µin | DIP ZIF (ZIP) | 7.62 mm | 0.3 in | Polyphenylene Sulfide (PPS) Glass Filled | Gold | 2 | 48 | 24 | 0.1 " | 2.54 mm | Beryllium Copper | Through Hole | Gold |
Aries Electronics | 0.11 in | 2.78 mm | 1 A | UL94 V-0 | 50 µin | 1.27 µm | 0.1 in | 2.54 mm | Closed Frame | Beryllium Nickel | Solder | 1.27 µm | 50 µin | DIP ZIF (ZIP) | 7.62 mm | 0.3 in | Polyphenylene Sulfide (PPS) Glass Filled | Nickel Boron | 2 | 48 | 24 | 0.1 " | 2.54 mm | Beryllium Nickel | Through Hole | Nickel Boron |
Aries Electronics | 0.11 in | 2.78 mm | 1 A | UL94 V-0 | 200 µin | 5.08 µm | 0.1 in | 2.54 mm | Closed Frame | Beryllium Copper | Solder | 5.08 µm | 200 µin | DIP ZIF (ZIP) | 7.62 mm | 0.3 in | Polyphenylene Sulfide (PPS) Glass Filled | 2 | 48 | 24 | 0.1 " | 2.54 mm | Beryllium Copper | Through Hole | Tin |