48-6513 Series
Manufacturer: Aries Electronics
CONN IC DIP SOCKET 48POS GOLD
| Part | Termination Post Length | Termination Post Length | Material Flammability Rating | Current Rating (Amps) | Features | Contact Material - Post [custom] | Mounting Type | Pitch - Post | Pitch - Post | Contact Finish - Post | Housing Material | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Pitch - Mating | Pitch - Mating | Termination | Contact Material - Mating | Operating Temperature [Min] | Operating Temperature [Max] | Type [custom] | Type [custom] | Type | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Number of Positions or Pins (Grid) [y] | Number of Positions or Pins (Grid) [custom] | Number of Positions or Pins (Grid) [x] | Contact Finish - Mating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | 0.125 in | 3.18 mm | UL94 V-0 | 3 A | Closed Frame | Brass | Through Hole | 0.1 in | 2.54 mm | Tin | Polyamide (PA46) Nylon 4/6 Glass Filled | 200 µin | 5.08 µm | 0.1 " | 2.54 mm | Solder | Beryllium Copper | -55 C | 105 ░C | 15.24 mm | 0.6 in | DIP | 0.25 µm | 10 µin | 2 | 48 | 24 | Gold |
Aries Electronics | 0.125 in | 3.18 mm | UL94 V-0 | 3 A | Closed Frame | Brass | Through Hole | 0.1 in | 2.54 mm | Tin | Polyamide (PA46) Nylon 4/6 Glass Filled | 200 µin | 5.08 µm | 0.1 " | 2.54 mm | Solder | Beryllium Copper | -55 C | 105 ░C | 15.24 mm | 0.6 in | DIP | 0.25 µm | 10 µin | 2 | 48 | 24 | Gold |
Aries Electronics | 0.125 in | 3.18 mm | UL94 V-0 | 3 A | Closed Frame | Brass | Through Hole | 0.1 in | 2.54 mm | Gold | Polyamide (PA46) Nylon 4/6 Glass Filled | 10 Áin | 0.25 çm | 0.1 " | 2.54 mm | Solder | Beryllium Copper | -55 C | 105 ░C | 15.24 mm | 0.6 in | DIP | 0.25 µm | 10 µin | 2 | 48 | 24 | Gold |
Aries Electronics | 0.125 in | 3.18 mm | UL94 V-0 | 3 A | Closed Frame | Brass | Through Hole | 0.1 in | 2.54 mm | Gold | Polyamide (PA46) Nylon 4/6 Glass Filled | 10 Áin | 0.25 çm | 0.1 " | 2.54 mm | Solder | Beryllium Copper | -55 C | 105 ░C | 15.24 mm | 0.6 in | DIP | 0.25 µm | 10 µin | 2 | 48 | 24 | Gold |