0513 Series

Catalog

IC & COMPONENT SOCKETS PIN LINE COLLET SCKT SOLDER TAIL 1 PIN

Part	Contact Finish - Post	Contact Finish - Mating	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Contact Material - Post [custom]	Number of Positions or Pins (Grid)	Termination	Housing Material	Type	Current Rating (Amps)	Material Flammability Rating	Termination Post Length	Termination Post Length	Pitch - Mating	Pitch - Mating	Pitch - Post	Pitch - Post	Number of Positions or Pins (Grid) [y]	Number of Positions or Pins (Grid)	Number of Positions or Pins (Grid) [x]	Number of Positions or Pins (Grid) [y]	Number of Positions or Pins (Grid) [x]	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]
Aries Electronics 01-0513-11H	Gold	Gold	10 Áin	0.25 çm	0.25 µm	10 µin	Beryllium Copper	Through Hole	Brass	1 (1 x 1)	Solder	Polyamide (PA46) Nylon 4/6 Glass Filled	SIP
Aries Electronics 15-0513-10T	Tin	Gold	200 µin	5.08 µm	0.25 µm	10 µin	Beryllium Copper	Through Hole	Brass		Solder	Polyamide (PA46) Nylon 4/6 Glass Filled	SIP	3 A	UL94 V-0	0.125 in	3.18 mm	0.1 "	2.54 mm	0.1 in	2.54 mm	15	15	1
Aries Electronics 07-0513-11H	Gold	Gold	10 Áin	0.25 çm	0.25 µm	10 µin	Beryllium Copper	Through Hole	Brass		Solder	Polyamide (PA46) Nylon 4/6 Glass Filled	SIP					0.1 "	2.54 mm	0.1 in	2.54 mm		7		7	1
Aries Electronics 06-0513-10T	Tin	Gold	200 µin	5.08 µm	0.25 µm	10 µin	Beryllium Copper	Through Hole	Brass		Solder	Polyamide (PA46) Nylon 4/6 Glass Filled	SIP	3 A	UL94 V-0	0.125 in	3.18 mm	0.1 "	2.54 mm	0.1 in	2.54 mm
Aries Electronics 02-0513-10T	Tin	Gold	200 µin	5.08 µm	0.25 µm	10 µin	Beryllium Copper	Through Hole	Brass		Solder	Polyamide (PA46) Nylon 4/6 Glass Filled	SIP					0.1 "	2.54 mm	0.1 in	2.54 mm		2				1 x 2
Aries Electronics 20-0513-11	Gold	Gold	10 Áin	0.25 çm	0.25 µm	10 µin	Beryllium Copper	Through Hole	Brass		Solder	Polyamide (PA46) Nylon 4/6 Glass Filled	SIP	3 A	UL94 V-0	0.125 in	3.18 mm	0.1 "	2.54 mm	0.1 in	2.54 mm		20
Aries Electronics 05-0513-11	Gold	Gold	10 Áin	0.25 çm	0.25 µm	10 µin	Beryllium Copper	Through Hole	Brass		Solder	Polyamide (PA46) Nylon 4/6 Glass Filled	SIP					0.1 "	2.54 mm	0.1 in	2.54 mm		5
Aries Electronics 20-0513-10	Tin	Gold	200 µin	5.08 µm	0.25 µm	10 µin	Beryllium Copper	Through Hole	Brass		Solder	Polyamide (PA46) Nylon 4/6 Glass Filled	SIP	3 A	UL94 V-0	0.125 in	3.18 mm	0.1 "	2.54 mm	0.1 in	2.54 mm		20
Aries Electronics 17-0513-11	Gold	Gold	10 Áin	0.25 çm	0.25 µm	10 µin	Beryllium Copper	Through Hole	Brass		Solder	Polyamide (PA46) Nylon 4/6 Glass Filled	SIP	3 A	UL94 V-0	0.125 in	3.18 mm	0.1 "	2.54 mm	0.1 in	2.54 mm	17	17	1
Aries Electronics 11-0513-10	Tin	Gold	200 µin	5.08 µm	0.25 µm	10 µin	Beryllium Copper	Through Hole	Brass		Solder	Polyamide (PA46) Nylon 4/6 Glass Filled	SIP	3 A	UL94 V-0	0.125 in	3.18 mm	0.1 "	2.54 mm	0.1 in	2.54 mm		11					1	11