24-C300 Series

Catalog

CONN IC DIP SOCKET 24POS GOLD

Part	Current Rating (Amps)	Termination Post Length	Termination Post Length	Material Flammability Rating	Contact Finish - Mating	Number of Positions or Pins (Grid) [x]	Number of Positions or Pins (Grid) [y]	Number of Positions or Pins (Grid)	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Termination	Contact Finish - Post	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Pitch - Mating	Pitch - Mating	Pitch - Post	Pitch - Post	Housing Material	Features	Operating Temperature [Min]	Operating Temperature [Max]	Contact Material - Mating	Contact Material - Post [custom]	Type [custom]	Type [custom]	Type	Mounting Type
Aries Electronics 24-C300-20	3 A	0.04 in	1.02 mm	UL94 V-0	Gold	12	2	24	200 µin	5.08 µm	Wire Wrap	Tin	0.25 µm	10 µin	0.1 "	2.54 mm	0.1 in	2.54 mm	Polyamide (PA46) Nylon 4/6 Glass Filled	Closed Frame	-55 C	105 ░C	Beryllium Copper	Brass	15.24 mm	0.6 in	DIP	Through Hole
Aries Electronics 24-C300-21	3 A	0.04 in	1.02 mm	UL94 V-0	Gold	12	2	24	10 Áin	0.25 çm	Wire Wrap	Gold	0.25 µm	10 µin	0.1 "	2.54 mm	0.1 in	2.54 mm	Polyamide (PA46) Nylon 4/6 Glass Filled	Closed Frame	-55 C	125 °C	Beryllium Copper	Brass	15.24 mm	0.6 in	DIP	Through Hole
Aries Electronics 24-C300-10	3 A	0.125 in	3.18 mm	UL94 V-0	Gold	12	2	24	200 µin	5.08 µm	Solder	Tin	0.25 µm	10 µin	0.1 "	2.54 mm	0.1 in	2.54 mm	Polyamide (PA46) Nylon 4/6 Glass Filled	Closed Frame	-55 C	105 ░C	Beryllium Copper	Brass	15.24 mm	0.6 in	DIP	Through Hole
Aries Electronics 24-C300-31	3 A	0.04 in	1.02 mm	UL94 V-0	Gold	12	2	24	10 Áin	0.25 çm	Wire Wrap	Gold	0.25 µm	10 µin	0.1 "	2.54 mm	0.1 in	2.54 mm	Polyamide (PA46) Nylon 4/6 Glass Filled	Closed Frame	-55 C	125 °C	Beryllium Copper	Brass	15.24 mm	0.6 in	DIP	Through Hole
Aries Electronics 24-C300-00	3 A	0.04 in	1.02 mm	UL94 V-0	Gold	12	2	24	200 µin	5.08 µm	Solder	Tin	0.25 µm	10 µin	0.1 "	2.54 mm	0.1 in	2.54 mm	Polyamide (PA46) Nylon 4/6 Glass Filled	Closed Frame	-55 C	105 ░C	Beryllium Copper	Brass	15.24 mm	0.6 in	DIP	Surface Mount