36-3553 Series

Catalog

CONN IC DIP SOCKET ZIF 36POS

Part	Material Flammability Rating	Current Rating (Amps)	Termination Post Length	Termination Post Length	Pitch - Post	Pitch - Post	Number of Positions or Pins (Grid)	Contact Finish - Post	Contact Material - Mating	Termination	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Operating Temperature [Min]	Operating Temperature [Max]	Mounting Type	Housing Material	Features	Type	Type	Type	Contact Material - Post	Contact Finish - Mating	Pitch - Mating	Pitch - Mating	Contact Finish Thickness - Post	Contact Finish Thickness - Post
Aries Electronics 36-3553-18	UL94 V-0	1 A	0.11 in	2.78 mm	0.1 in	2.54 mm	36	Nickel Boron	Beryllium Nickel	Solder	50 µin	1.27 µm	-55 C	250 °C	Through Hole	Polyetheretherketone (PEEK) Glass Filled	Closed Frame	DIP ZIF (ZIP)	7.62 mm	0.3 in	Beryllium Nickel	Nickel Boron	0.1 "	2.54 mm	1.27 µm	50 µin
Aries Electronics 36-3553-10	UL94 V-0	1 A	0.11 in	2.78 mm	0.1 in	2.54 mm	36	Tin	Beryllium Copper	Solder	200 µin	5.08 µm			Through Hole	Polyphenylene Sulfide (PPS) Glass Filled	Closed Frame	DIP ZIF (ZIP)	7.62 mm	0.3 in	Beryllium Copper		0.1 "	2.54 mm	5.08 µm	200 µin
Aries Electronics 36-3553-16	UL94 V-0	1 A	0.11 in	2.78 mm	0.1 in	2.54 mm	36	Nickel Boron	Beryllium Copper	Solder	50 µin	1.27 µm			Through Hole	Polyphenylene Sulfide (PPS) Glass Filled	Closed Frame	DIP ZIF (ZIP)	7.62 mm	0.3 in	Beryllium Copper	Nickel Boron	0.1 "	2.54 mm	1.27 µm	50 µin