24-C182 Series

Catalog

CONN IC DIP SOCKET 24POS GOLD

Part	Termination Post Length	Termination Post Length	Current Rating (Amps)	Material Flammability Rating	Number of Positions or Pins (Grid) [x]	Number of Positions or Pins (Grid) [y]	Number of Positions or Pins (Grid)	Type [custom]	Type [custom]	Type	Mounting Type	Termination	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Features	Contact Material - Mating	Contact Material - Post [custom]	Contact Finish - Mating	Housing Material	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Operating Temperature [Min]	Operating Temperature [Max]	Pitch - Post	Pitch - Post	Pitch - Mating	Pitch - Mating	Contact Finish - Post
Aries Electronics 24-C182-10	0.125 in	3.18 mm	3 A	UL94 V-0	12	2	24	15.24 mm	0.6 in	DIP	Through Hole	Solder	200 µin	5.08 µm	Closed Frame	Beryllium Copper	Brass	Gold	Polyamide (PA46) Nylon 4/6 Glass Filled	0.25 µm	10 µin	-55 C	105 ░C	0.1 in	2.54 mm	0.1 "	2.54 mm	Tin
Aries Electronics 24-C182-21	0.04 in	1.02 mm	3 A	UL94 V-0	12	2	24	15.24 mm	0.6 in	DIP	Through Hole	Wire Wrap	10 Áin	0.25 çm	Closed Frame	Beryllium Copper	Brass	Gold	Polyamide (PA46) Nylon 4/6 Glass Filled	0.25 µm	10 µin	-55 C	125 °C	0.1 in	2.54 mm	0.1 "	2.54 mm	Gold
Aries Electronics 24-C182-31	0.04 in	1.02 mm	3 A	UL94 V-0	12	2	24	15.24 mm	0.6 in	DIP	Through Hole	Wire Wrap	10 Áin	0.25 çm	Closed Frame	Beryllium Copper	Brass	Gold	Polyamide (PA46) Nylon 4/6 Glass Filled	0.25 µm	10 µin	-55 C	125 °C	0.1 in	2.54 mm	0.1 "	2.54 mm	Gold
Aries Electronics 24-C182-11H	0.125 in	3.18 mm	3 A	UL94 V-0	12	2	24	15.24 mm	0.6 in	DIP	Through Hole	Solder	10 Áin	0.25 çm	Closed Frame	Beryllium Copper	Brass	Gold	Polyamide (PA46) Nylon 4/6 Glass Filled	0.25 µm	10 µin	-55 C	125 °C	0.1 in	2.54 mm	0.1 "	2.54 mm	Gold
Aries Electronics 24-C182-00	0.04 in	1.02 mm	3 A	UL94 V-0	12	2	24	15.24 mm	0.6 in	DIP	Surface Mount	Solder	200 µin	5.08 µm	Closed Frame	Beryllium Copper	Brass	Gold	Polyamide (PA46) Nylon 4/6 Glass Filled	0.25 µm	10 µin	-55 C	105 ░C	0.1 in	2.54 mm	0.1 "	2.54 mm	Tin
Aries Electronics 24-C182-20	0.04 in	1.02 mm	3 A	UL94 V-0	12	2	24	15.24 mm	0.6 in	DIP	Through Hole	Wire Wrap	200 µin	5.08 µm	Closed Frame	Beryllium Copper	Brass	Gold	Polyamide (PA46) Nylon 4/6 Glass Filled	0.25 µm	10 µin	-55 C	105 ░C	0.1 in	2.54 mm	0.1 "	2.54 mm	Tin
Aries Electronics 24-C182-30	0.04 in	1.02 mm	3 A	UL94 V-0	12	2	24	15.24 mm	0.6 in	DIP	Through Hole	Wire Wrap	200 µin	5.08 µm	Closed Frame	Beryllium Copper	Brass	Gold	Polyamide (PA46) Nylon 4/6 Glass Filled	0.25 µm	10 µin	-55 C	105 ░C	0.1 in	2.54 mm	0.1 "	2.54 mm	Tin