23-0513 Series
Manufacturer: Aries Electronics
CONN SOCKET SIP 23POS GOLD
| Part | Material Flammability Rating | Termination Post Length | Termination Post Length | Current Rating (Amps) | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Type | Contact Finish - Post | Pitch - Post | Pitch - Post | Pitch - Mating | Pitch - Mating | Contact Material - Mating | Termination | Contact Material - Post [custom] | Contact Finish - Mating | Number of Positions or Pins (Grid) | Housing Material | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Mounting Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | UL94 V-0 | 0.125 in | 3.18 mm | 3 A | 200 µin | 5.08 µm | SIP | Tin | 0.1 in | 2.54 mm | 0.1 " | 2.54 mm | Beryllium Copper | Solder | Brass | Gold | 23 | Polyamide (PA46) Nylon 4/6 Glass Filled | 0.25 µm | 10 µin | Through Hole |
Aries Electronics | UL94 V-0 | 0.125 in | 3.18 mm | 3 A | 10 Áin | 0.25 çm | SIP | Gold | 0.1 in | 2.54 mm | 0.1 " | 2.54 mm | Beryllium Copper | Solder | Brass | Gold | 23 | Polyamide (PA46) Nylon 4/6 Glass Filled | 0.25 µm | 10 µin | Through Hole |
Aries Electronics | UL94 V-0 | 0.125 in | 3.18 mm | 3 A | 10 Áin | 0.25 çm | SIP | Gold | 0.1 in | 2.54 mm | 0.1 " | 2.54 mm | Beryllium Copper | Solder | Brass | Gold | 23 | Polyamide (PA46) Nylon 4/6 Glass Filled | 0.25 µm | 10 µin | Through Hole |
Aries Electronics | UL94 V-0 | 0.125 in | 3.18 mm | 3 A | 200 µin | 5.08 µm | SIP | Tin | 0.1 in | 2.54 mm | 0.1 " | 2.54 mm | Beryllium Copper | Solder | Brass | Gold | 23 | Polyamide (PA46) Nylon 4/6 Glass Filled | 0.25 µm | 10 µin | Through Hole |
Aries Electronics | UL94 V-0 | 0.125 in | 3.18 mm | 3 A | 200 µin | 5.08 µm | SIP | Tin | 0.1 in | 2.54 mm | 0.1 " | 2.54 mm | Beryllium Copper | Solder | Brass | Gold | 23 | Polyamide (PA46) Nylon 4/6 Glass Filled | 0.25 µm | 10 µin | Through Hole |