42-6574 Series

Catalog

CONN IC DIP SOCKET ZIF 42POS TIN

Part	Material Flammability Rating	Termination Post Length	Termination Post Length	Current Rating (Amps)	Pitch - Mating	Pitch - Mating	Type	Type	Mounting Type	Pitch - Post	Pitch - Post	Housing Material	Termination	Contact Material - Mating	Contact Material - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Number of Positions or Pins (Grid)	Features	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating
Aries Electronics 42-6574-16	UL94 V-0	0.11 in	2.78 mm	1 A	0.1 "	2.54 mm	DIP ZIF (ZIP)	0.6 " (15.24mm) Row Spacing	Through Hole	0.1 in	2.54 mm	Polyphenylene Sulfide (PPS) Glass Filled	Solder	Beryllium Copper	Beryllium Copper	Tin	200 µin	5.08 µm	42	Closed Frame	5.08 µm	200 µin
Aries Electronics 42-6574-10	UL94 V-0	0.11 in	2.78 mm	1 A	0.1 "	2.54 mm	DIP ZIF (ZIP)	0.6 " (15.24mm) Row Spacing	Through Hole	0.1 in	2.54 mm	Polyphenylene Sulfide (PPS) Glass Filled	Solder	Beryllium Copper	Beryllium Copper	Tin	200 µin	5.08 µm	42	Closed Frame	5.08 µm	200 µin
Aries Electronics 42-6574-18	UL94 V-0	0.11 in	2.78 mm	1 A	0.1 "	2.54 mm	DIP ZIF (ZIP)	0.6 " (15.24mm) Row Spacing	Through Hole	0.1 in	2.54 mm	Polyphenylene Sulfide (PPS) Glass Filled	Solder	Beryllium Copper	Beryllium Copper	Tin	200 µin	5.08 µm	42	Closed Frame	5.08 µm	200 µin
Aries Electronics 42-6574-11	UL94 V-0	0.11 in	2.78 mm	1 A	0.1 "	2.54 mm	DIP ZIF (ZIP)	0.6 " (15.24mm) Row Spacing	Through Hole	0.1 in	2.54 mm	Polyphenylene Sulfide (PPS) Glass Filled	Solder	Beryllium Copper	Beryllium Copper	Tin	200 µin	5.08 µm	42	Closed Frame	5.08 µm	200 µin