40-6574 Series

Catalog

CONN IC DIP SOCKET ZIF 40POS TIN

Part	Current Rating (Amps)	Material Flammability Rating	Termination Post Length	Termination Post Length	Number of Positions or Pins (Grid)	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Type	Type	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Features	Mounting Type	Contact Finish - Post	Housing Material	Pitch - Mating	Pitch - Mating	Termination	Pitch - Post	Pitch - Post	Contact Material - Post
Aries Electronics 40-6574-10	1 A	UL94 V-0	0.11 in	2.78 mm	40	200 µin	5.08 µm	DIP ZIF (ZIP)	0.6 " (15.24mm) Row Spacing	5.08 µm	200 µin	Beryllium Copper	Closed Frame	Through Hole	Tin	Polyphenylene Sulfide (PPS) Glass Filled	0.1 "	2.54 mm	Solder	0.1 in	2.54 mm	Beryllium Copper
Aries Electronics 40-6574-11	1 A	UL94 V-0	0.11 in	2.78 mm	40	200 µin	5.08 µm	DIP ZIF (ZIP)	0.6 " (15.24mm) Row Spacing	5.08 µm	200 µin	Beryllium Copper	Closed Frame	Through Hole	Tin	Polyphenylene Sulfide (PPS) Glass Filled	0.1 "	2.54 mm	Solder	0.1 in	2.54 mm	Beryllium Copper
Aries Electronics 40-6574-16	1 A	UL94 V-0	0.11 in	2.78 mm	40	200 µin	5.08 µm	DIP ZIF (ZIP)	0.6 " (15.24mm) Row Spacing	5.08 µm	200 µin	Beryllium Copper	Closed Frame	Through Hole	Tin	Polyphenylene Sulfide (PPS) Glass Filled	0.1 "	2.54 mm	Solder	0.1 in	2.54 mm	Beryllium Copper