36-1518 Series
Manufacturer: Aries Electronics
Beta
⌘K
CONN IC DIP SOCKET 36POS GOLD
| Part | Material Flammability Rating | Current Rating (Amps) | Termination Post Length | Termination Post Length | Contact Material - Post [custom] | Termination | Features | Contact Finish - Post | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Housing Material | Pitch - Mating | Pitch - Mating | Pitch - Post | Pitch - Post | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Number of Positions or Pins (Grid) | Mounting Type | Contact Finish - Mating | Type | Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Aries Electronics | UL94 V-0 | 3 A | 0.125 in | 3.18 mm | Brass | Solder | Open Frame | Tin | 0.25 µm | 10 µin | Beryllium Copper | Polyamide (PA46) Nylon 4/6 Glass Filled | 0.1 " | 2.54 mm | 0.1 in | 2.54 mm | 200 µin | 5.08 µm | 36 | Through Hole | Gold | DIP | 5.08 mm |
Aries Electronics | UL94 V-0 | 3 A | 0.125 in | 3.18 mm | Brass | Solder | Open Frame | Gold | 0.25 µm | 10 µin | Beryllium Copper | Polyamide (PA46) Nylon 4/6 Glass Filled | 0.1 " | 2.54 mm | 0.1 in | 2.54 mm | 10 Áin | 0.25 çm | 36 | Through Hole | Gold | DIP | 5.08 mm |
Aries Electronics | UL94 V-0 | 3 A | 0.125 in | 3.18 mm | Brass | Solder | Open Frame | Tin | 0.25 µm | 10 µin | Beryllium Copper | Polyamide (PA46) Nylon 4/6 Glass Filled | 0.1 " | 2.54 mm | 0.1 in | 2.54 mm | 200 µin | 5.08 µm | 36 | Through Hole | Gold | DIP | 5.08 mm |