Catalog
Memory Module Temp. Sensor
Key Features
• * Meets JEDEC Specification TSE3000B3
• * Optimized for Voltage Range: 3.0V to 3.6V
• * Shutdown/Standby Current: 3 µA (max.)
• * meets 25ms to 35ms SMbus timeout
• * DFN-8, TDFN-8, UDFN-8, TSSOP-8
• * AEC-Q100 Qualified Grade 1
• * Class B — Temperature-to-Digital Converter
• * ±0.5°C/±1°C (typ./max.) ? +75°C to +95°C
• * ±1°C/±2°C (typ./max.) ? +40°C to +125°C
• * ±2°C/±3°C (typ./max.) ?
• * 20°C to +125°C
• * Operating Current: 200 µA (typical)
Description
AI
Microchip Technology Inc.’s MCP98243 digital temperature sensor converts temperature from -40°C and +125°C to a digital word. This sensor meets JEDEC Specification TSE3000B3 Mobile Platform Memory Module Thermal Sensor Component. It provides an accuracy of ±0.5°C/±1°C (typical/maximum) from +75°C to +95°C.
