22-4508 Series
Manufacturer: Aries Electronics
CONN IC DIP SOCKET 22POS GOLD
| Part | Material Flammability Rating | Current Rating (Amps) | Termination Post Length | Termination Post Length | Features | Number of Positions or Pins (Grid) [y] | Number of Positions or Pins (Grid) | Number of Positions or Pins (Grid) [x] | Contact Finish - Post | Contact Material - Post [custom] | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Operating Temperature [Min] | Operating Temperature [Max] | Type | Type | Contact Finish - Mating | Pitch - Mating | Pitch - Mating | Termination | Pitch - Post | Pitch - Post | Housing Material | Mounting Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | UL94 V-0 | 3 A | 0.5 in | 12.7 mm | Open Frame | 11 | 22 | 2 | Tin | Brass | 200 µin | 5.08 µm | 0.76 Ám | 30 Áin | Beryllium Copper | -55 C | 105 ░C | 0.4 in | DIP | Gold | 0.1 " | 2.54 mm | Wire Wrap | 0.1 in | 2.54 mm | Polyamide (PA46) Nylon 4/6 Glass Filled | Through Hole |
Aries Electronics | UL94 V-0 | 3 A | 0.36 in | 9.14 mm | Open Frame | 11 | 22 | 2 | Gold | Brass | 10 Áin | 0.25 çm | 0.76 Ám | 30 Áin | Beryllium Copper | -55 C | 125 °C | 0.4 in | DIP | Gold | 0.1 " | 2.54 mm | Wire Wrap | 0.1 in | 2.54 mm | Polyamide (PA46) Nylon 4/6 Glass Filled | Through Hole |
Aries Electronics | UL94 V-0 | 3 A | 0.36 in | 9.14 mm | Open Frame | 11 | 22 | 2 | Tin | Brass | 200 µin | 5.08 µm | 0.76 Ám | 30 Áin | Beryllium Copper | -55 C | 105 ░C | 0.4 in | DIP | Gold | 0.1 " | 2.54 mm | Wire Wrap | 0.1 in | 2.54 mm | Polyamide (PA46) Nylon 4/6 Glass Filled | Through Hole |