257-PLS Series
Manufacturer: Aries Electronics
CONN SOCKET PGA ZIF GOLD
| Part | Termination Post Length | Termination Post Length | Material Flammability Rating | Current Rating (Amps) | Mounting Type | Contact Material - Post | Pitch - Post | Pitch - Post | Termination | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Features | Pitch - Mating | Pitch - Mating | Contact Finish - Mating | Contact Material - Mating | Type | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Operating Temperature [Min] | Operating Temperature [Max] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | 0.125 in | 3.18 mm | UL94 V-0 | 1 A | Through Hole | Beryllium Copper | 0.1 in | 2.54 mm | Solder | 200 µin | 5.08 µm | Closed Frame | 0.1 " | 2.54 mm | Gold | Beryllium Copper | PGA ZIF (ZIP) | 0.76 Ám | 30 Áin | Tin | -65 ░C | 125 °C |
Aries Electronics | 0.125 in | 3.18 mm | UL94 V-0 | 1 A | Through Hole | Beryllium Copper | 0.1 in | 2.54 mm | Solder | 200 µin | 5.08 µm | Closed Frame | 0.1 " | 2.54 mm | Gold | Beryllium Copper | PGA ZIF (ZIP) | 0.76 Ám | 30 Áin | Tin | -65 ░C | 125 °C |
Aries Electronics | 0.125 in | 3.18 mm | UL94 V-0 | 1 A | Through Hole | Beryllium Copper | 0.1 in | 2.54 mm | Solder | 200 µin | 5.08 µm | Closed Frame | 0.1 " | 2.54 mm | Gold | Beryllium Copper | PGA ZIF (ZIP) | 0.76 Ám | 30 Áin | Tin | -65 ░C | 125 °C |