32-6553 Series
Manufacturer: Aries Electronics
Beta
⌘K
CONN IC DIP SOCKET ZIF 36POS TIN
| Part | Current Rating (Amps) | Termination Post Length | Termination Post Length | Material Flammability Rating | Contact Material - Mating | Termination | Contact Finish - Post | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Pitch - Post | Pitch - Post | Number of Positions or Pins (Grid) | Mounting Type | Pitch - Mating | Pitch - Mating | Contact Material - Post | Housing Material | Features | Type | Type | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Operating Temperature [Min] | Operating Temperature [Max] | Contact Finish - Mating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Aries Electronics | 1 A | 0.11 in | 2.78 mm | UL94 V-0 | Beryllium Copper | Solder | Tin | 5.08 µm | 200 µin | 0.1 in | 2.54 mm | 36 | Through Hole | 0.1 " | 2.54 mm | Beryllium Copper | Polyphenylene Sulfide (PPS) Glass Filled | Closed Frame | DIP ZIF (ZIP) | 0.6 " (15.24mm) Row Spacing | 200 µin | 5.08 µm | |||
Aries Electronics | 1 A | 0.11 in | 2.78 mm | UL94 V-0 | Beryllium Nickel | Solder | Nickel Boron | 1.27 µm | 50 µin | 0.1 in | 2.54 mm | 32 | Through Hole | 0.1 " | 2.54 mm | Beryllium Nickel | Polyetheretherketone (PEEK) Glass Filled | Closed Frame | DIP ZIF (ZIP) | 0.6 " (15.24mm) Row Spacing | 50 µin | 1.27 µm | -55 C | 250 °C | Nickel Boron |