32-6513 Series

Catalog

CONN IC DIP SOCKET 32POS GOLD

Part	Termination Post Length	Termination Post Length	Current Rating (Amps)	Material Flammability Rating	Contact Finish - Post	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Pitch - Mating	Pitch - Mating	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Type [custom]	Type [custom]	Type	Pitch - Post	Pitch - Post	Housing Material	Mounting Type	Termination	Number of Positions or Pins (Grid)	Features	Contact Material - Mating	Contact Finish - Mating	Contact Material - Post [custom]	Operating Temperature [Min]	Operating Temperature [Max]
Aries Electronics 32-6513-11	0.125 in	3.18 mm	3 A	UL94 V-0	Gold	0.25 µm	10 µin	0.1 "	2.54 mm	10 Áin	0.25 çm	15.24 mm	0.6 in	DIP	0.1 in	2.54 mm	Polyamide (PA46) Nylon 4/6 Glass Filled	Through Hole	Solder	32	Closed Frame	Beryllium Copper	Gold	Brass	-55 C	105 ░C
Aries Electronics 32-6513-10H	0.125 in	3.18 mm	3 A	UL94 V-0	Tin	0.25 µm	10 µin	0.1 "	2.54 mm	200 µin	5.08 µm	15.24 mm	0.6 in	DIP	0.1 in	2.54 mm	Polyamide (PA46) Nylon 4/6 Glass Filled	Through Hole	Solder	32	Closed Frame	Beryllium Copper	Gold	Brass	-55 C	105 ░C
Aries Electronics 32-6513-10	0.125 in	3.18 mm	3 A	UL94 V-0	Tin	0.25 µm	10 µin	0.1 "	2.54 mm	200 µin	5.08 µm	15.24 mm	0.6 in	DIP	0.1 in	2.54 mm	Polyamide (PA46) Nylon 4/6 Glass Filled	Through Hole	Solder	32	Closed Frame	Beryllium Copper	Gold	Brass	-55 C	105 ░C
Aries Electronics 32-6513-11H	0.125 in	3.18 mm	3 A	UL94 V-0	Gold	0.25 µm	10 µin	0.1 "	2.54 mm	10 Áin	0.25 çm	15.24 mm	0.6 in	DIP	0.1 in	2.54 mm	Polyamide (PA46) Nylon 4/6 Glass Filled	Through Hole	Solder	32	Closed Frame	Beryllium Copper	Gold	Brass	-55 C	105 ░C
Aries Electronics 32-6513-10T	0.125 in	3.18 mm	3 A	UL94 V-0	Tin	0.25 µm	10 µin	0.1 "	2.54 mm	200 µin	5.08 µm	15.24 mm	0.6 in	DIP	0.1 in	2.54 mm	Polyamide (PA46) Nylon 4/6 Glass Filled	Through Hole	Solder	32	Closed Frame	Beryllium Copper	Gold	Brass	-55 C	105 ░C