1.50mm Pitch, Pico-Lock PCB Header, Single Row, Right-Angle, Surface Mount, Gold (Au) Plating, Positive Lock, 9 Circuits, Tape and Reel
1.50mm Pitch, Pico-Lock PCB Header, Single Row, Right-Angle, Surface Mount, Gold (Au) Plating, Positive Lock, 9 Circuits, Tape and Reel
1.50mm Pitch, Pico-Lock PCB Header, Single Row, Right-Angle, Surface Mount, Gold (Au) Plating, Positive Lock, 9 Circuits, Tape and Reel
| Part | Insulation Height | Insulation Height | Contact Material | Fastening Type | Contact Finish - Post | Style | Termination | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Voltage Rating | Number of Rows | Material Flammability Rating | Connector Type | Contact Finish - Mating | Features | Number of Positions Loaded | Contact Shape | Insulation Material | Insulation Color | Current Rating (Amps) | Number of Positions | Contact Type | Mounting Type | Operating Temperature [Min] | Operating Temperature [Max] | Shrouding |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Molex | 0.079 in | 2 mm | Copper Alloy | Detent Lock | Gold | Board to Cable/Wire | Solder | 3.94 µin | 0.1 µm | 150 VDC | 1 | UL94 V-0 | Header | Gold | Solder Retention | All | Rectangular | Nylon Polyamide (PA) | Black | Varies by Wire Gauge | 11 | Male Blade | Surface Mount Right Angle | -40 °C | 105 ░C | Shrouded - 4 Wall |
 Molex | 0.079 in | 2 mm | Copper Alloy | Detent Lock | Gold | Board to Cable/Wire | Solder | 3.94 µin | 0.1 µm | 150 VDC | 1 | UL94 V-0 | Header | Gold | Solder Retention | All | Rectangular | Nylon Polyamide (PA) | Black | Varies by Wire Gauge | 7 | Male Blade | Surface Mount Right Angle | -40 °C | 105 ░C | Shrouded - 4 Wall |
 Molex | 0.079 in | 2 mm | Copper Alloy | Detent Lock | Gold | Board to Cable/Wire | Solder | 3.94 µin | 0.1 µm | 150 VDC | 1 | UL94 V-0 | Header | Gold | Solder Retention | All | Rectangular | Nylon Polyamide (PA) | Black | Varies by Wire Gauge | 10 | Male Blade | Surface Mount Right Angle | -40 °C | 105 ░C | Shrouded - 4 Wall |
 Molex | 0.079 in | 2 mm | Copper Alloy | Detent Lock | Gold | Board to Cable/Wire | Solder | 3.94 µin | 0.1 µm | 150 VDC | 1 | UL94 V-0 | Header | Gold | Solder Retention | All | Rectangular | Nylon Polyamide (PA) | Black | Varies by Wire Gauge | 6 | Male Blade | Surface Mount Right Angle | -40 °C | 105 ░C | Shrouded - 4 Wall |
 Molex | 0.079 in | 2 mm | Copper Alloy | Detent Lock | Gold | Board to Cable/Wire | Solder | 3.94 µin | 0.1 µm | 150 VDC | 1 | UL94 V-0 | Header | Gold | Solder Retention | All | Rectangular | Nylon Polyamide (PA) | Black | Varies by Wire Gauge | 2 | Male Blade | Surface Mount Right Angle | -40 °C | 105 ░C | Shrouded - 4 Wall |
 Molex | 0.079 in | 2 mm | Copper Alloy | Detent Lock | Gold | Board to Cable/Wire | Solder | 3.94 µin | 0.1 µm | 150 VDC | 1 | UL94 V-0 | Header | Gold | Solder Retention | All | Rectangular | Nylon Polyamide (PA) | Black | Varies by Wire Gauge | 4 | Male Blade | Surface Mount Right Angle | -40 °C | 105 ░C | Shrouded - 4 Wall |
Molex | 0.079 in | 2 mm | Copper Alloy | Detent Lock | Gold | Board to Cable/Wire | Solder | 3.94 µin | 0.1 µm | 150 VDC | 1 | UL94 V-0 | Header | Gold | Solder Retention | All | Rectangular | Nylon Polyamide (PA) | Black | Varies by Wire Gauge | Male Blade | Surface Mount Right Angle | -40 °C | 105 ░C | Shrouded - 4 Wall | |
 Molex | 0.079 in | 2 mm | Copper Alloy | Detent Lock | Gold | Board to Cable/Wire | Solder | 3.94 µin | 0.1 µm | 150 VDC | 1 | UL94 V-0 | Header | Gold | Solder Retention | All | Rectangular | Nylon Polyamide (PA) | Black | Varies by Wire Gauge | 12 | Male Blade | Surface Mount Right Angle | -40 °C | 105 ░C | Shrouded - 4 Wall |