28-6518 Series

Catalog

CONN IC DIP SOCKET 28POS GOLD

Part	Termination Post Length	Termination Post Length	Material Flammability Rating	Current Rating (Amps)	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Number of Positions or Pins (Grid)	Housing Material	Type [custom]	Type [custom]	Type	Contact Finish - Mating	Pitch - Post	Pitch - Post	Contact Material - Post [custom]	Contact Material - Mating	Mounting Type	Termination	Contact Finish - Post	Features	Pitch - Mating	Pitch - Mating	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating
Aries Electronics 28-6518-00	0.125 in	3.18 mm	UL94 V-0	3 A	200 µin	5.08 µm	28	Polyamide (PA46) Nylon 4/6 Glass Filled	15.24 mm	0.6 in	DIP	Gold	0.1 in	2.54 mm	Brass	Beryllium Copper	Surface Mount	Solder	Tin	Open Frame	0.1 "	2.54 mm	0.25 µm	10 µin
Aries Electronics 28-6518-11H	0.125 in	3.18 mm	UL94 V-0	3 A	10 Áin	0.25 çm	28	Polyamide (PA46) Nylon 4/6 Glass Filled	15.24 mm	0.6 in	DIP	Gold	0.1 in	2.54 mm	Brass	Beryllium Copper	Through Hole	Solder	Gold	Open Frame	0.1 "	2.54 mm	0.25 µm	10 µin
Aries Electronics 28-6518-10	0.125 in	3.18 mm	UL94 V-0	3 A	200 µin	5.08 µm	28	Polyamide (PA46) Nylon 4/6 Glass Filled	15.24 mm	0.6 in	DIP	Gold	0.1 in	2.54 mm	Brass	Beryllium Copper	Through Hole	Solder	Tin	Open Frame	0.1 "	2.54 mm	0.25 µm	10 µin
Aries Electronics 28-6518-112	0.125 in	3.18 mm	UL94 V-0	3 A	10 Áin	0.25 çm	28	Polyamide (PA46) Nylon 4/6 Glass Filled	15.24 mm	0.6 in	DIP	Gold	0.1 in	2.54 mm	Brass	Beryllium Copper	Through Hole	Solder	Gold	Open Frame	0.1 "	2.54 mm	0.25 µm	10 µin
Aries Electronics 28-6518-01	0.125 in	3.18 mm	UL94 V-0	3 A	10 Áin	0.25 çm	28	Polyamide (PA46) Nylon 4/6 Glass Filled	15.24 mm	0.6 in	DIP	Gold	0.1 in	2.54 mm	Brass	Beryllium Copper	Through Hole	Solder	Gold	Open Frame	0.1 "	2.54 mm	0.25 µm	10 µin