42-3554 Series

Catalog

CONN IC DIP SOCKET ZIF 42POS

Part	Material Flammability Rating	Termination Post Length	Termination Post Length	Current Rating (Amps)	Type	Type	Type	Mounting Type	Contact Material - Mating	Contact Finish - Post	Features	Housing Material	Pitch - Post	Pitch - Post	Operating Temperature [Min]	Operating Temperature [Max]	Termination	Number of Positions or Pins (Grid)	Contact Material - Post	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Pitch - Mating	Pitch - Mating	Contact Finish - Mating
Aries Electronics 42-3554-18	UL94 V-0	0.11 in	2.78 mm	1 A	DIP ZIF (ZIP)	7.62 mm	0.3 in	Through Hole	Beryllium Nickel	Nickel Boron	Closed Frame	Polyetheretherketone (PEEK) Glass Filled	0.1 in	2.54 mm	-55 C	250 °C	Solder	42	Beryllium Nickel	50 µin	1.27 µm	1.27 µm	50 µin	0.1 "	2.54 mm	Nickel Boron
Aries Electronics 42-3554-16	UL94 V-0	0.11 in	2.78 mm	1 A	DIP ZIF (ZIP)	7.62 mm	0.3 in	Through Hole	Beryllium Copper	Nickel Boron	Closed Frame	Polyphenylene Sulfide (PPS) Glass Filled	0.1 in	2.54 mm			Solder	42	Beryllium Copper	50 µin	1.27 µm	1.27 µm	50 µin	0.1 "	2.54 mm	Nickel Boron
Aries Electronics 42-3554-11	UL94 V-0	0.11 in	2.78 mm	1 A	DIP ZIF (ZIP)	7.62 mm	0.3 in	Through Hole	Beryllium Copper	Gold	Closed Frame	Polyphenylene Sulfide (PPS) Glass Filled	0.1 in	2.54 mm			Solder	42	Beryllium Copper					0.1 "	2.54 mm	Gold
Aries Electronics 42-3554-10	UL94 V-0	0.11 in	2.78 mm	1 A	DIP ZIF (ZIP)	7.62 mm	0.3 in	Through Hole	Beryllium Copper	Tin	Closed Frame	Polyphenylene Sulfide (PPS) Glass Filled	0.1 in	2.54 mm			Solder	42	Beryllium Copper	200 µin	5.08 µm	5.08 µm	200 µin	0.1 "	2.54 mm