48-3554 Series

Catalog

CONN IC DIP SOCKET ZIF 48POS TIN

Part	Material Flammability Rating	Current Rating (Amps)	Termination Post Length	Termination Post Length	Termination	Number of Positions or Pins (Grid) [y]	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [x]	Contact Material - Mating	Features	Mounting Type	Contact Finish - Post	Housing Material	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Pitch - Post	Pitch - Post	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Type	Type	Type	Contact Material - Post	Pitch - Mating	Pitch - Mating	Contact Finish - Mating	Operating Temperature [Min]	Operating Temperature [Max]
Aries Electronics 48-3554-10	UL94 V-0	1 A	0.11 in	2.78 mm	Solder	2	48	24	Beryllium Copper	Closed Frame	Through Hole	Tin	Polyphenylene Sulfide (PPS) Glass Filled	200 µin	5.08 µm	0.1 in	2.54 mm	5.08 µm	200 µin	DIP ZIF (ZIP)	7.62 mm	0.3 in	Beryllium Copper	0.1 "	2.54 mm
Aries Electronics 48-3554-16	UL94 V-0	1 A	0.11 in	2.78 mm	Solder	2	48	24	Beryllium Copper	Closed Frame	Through Hole	Nickel Boron	Polyphenylene Sulfide (PPS) Glass Filled	50 µin	1.27 µm	0.1 in	2.54 mm	1.27 µm	50 µin	DIP ZIF (ZIP)	7.62 mm	0.3 in	Beryllium Copper	0.1 "	2.54 mm	Nickel Boron
Aries Electronics 48-3554-18	UL94 V-0	1 A	0.11 in	2.78 mm	Solder	2	48	24	Beryllium Nickel	Closed Frame	Through Hole	Nickel Boron	Polyetheretherketone (PEEK) Glass Filled	50 µin	1.27 µm	0.1 in	2.54 mm	1.27 µm	50 µin	DIP ZIF (ZIP)	7.62 mm	0.3 in	Beryllium Nickel	0.1 "	2.54 mm	Nickel Boron	-55 C	250 °C
Aries Electronics 48-3554-11	UL94 V-0	1 A	0.11 in	2.78 mm	Solder	2	48	24	Beryllium Copper	Closed Frame	Through Hole	Gold	Polyphenylene Sulfide (PPS) Glass Filled			0.1 in	2.54 mm			DIP ZIF (ZIP)	7.62 mm	0.3 in	Beryllium Copper	0.1 "	2.54 mm	Gold