24-6573 Series
Manufacturer: Aries Electronics
Beta
⌘K
CONN IC DIP SOCKET ZIF 24POS
| Part | Current Rating (Amps) | Termination Post Length | Termination Post Length | Material Flammability Rating | Features | Contact Material - Post | Contact Finish - Mating | Termination | Type | Type | Contact Finish - Post | Pitch - Post | Pitch - Post | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Number of Positions or Pins (Grid) [x] | Number of Positions or Pins (Grid) [y] | Number of Positions or Pins (Grid) | Mounting Type | Housing Material | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Mating | Pitch - Mating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Aries Electronics | 1 A | 0.11 in | 2.78 mm | UL94 V-0 | Closed Frame | Beryllium Nickel | Nickel Boron | Solder | DIP ZIF (ZIP) | 0.6 " (15.24mm) Row Spacing | Nickel Boron | 0.1 in | 2.54 mm | 1.27 µm | 50 µin | 12 | 2 | 24 | Through Hole | Polyphenylene Sulfide (PPS) Glass Filled | 50 µin | 1.27 µm | Beryllium Nickel | 0.1 " | 2.54 mm |
Aries Electronics | 1 A | 0.11 in | 2.78 mm | UL94 V-0 | Closed Frame | Beryllium Copper | Solder | DIP ZIF (ZIP) | 0.6 " (15.24mm) Row Spacing | Tin | 0.1 in | 2.54 mm | 5.08 µm | 200 µin | 12 | 2 | 24 | Through Hole | Polyphenylene Sulfide (PPS) Glass Filled | 200 µin | 5.08 µm | Beryllium Copper | 0.1 " | 2.54 mm |