18-3508 Series
Manufacturer: Aries Electronics
CONN IC DIP SOCKET 18POS GOLD
| Part | Material Flammability Rating | Current Rating (Amps) | Termination Post Length | Termination Post Length | Contact Material - Post [custom] | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish - Post | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Pitch - Mating | Pitch - Mating | Contact Material - Mating | Mounting Type | Termination | Pitch - Post | Pitch - Post | Housing Material | Operating Temperature [Min] | Operating Temperature [Max] | Features | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Type | Type | Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | UL94 V-0 | 3 A | 0.5 in | 12.7 mm | Brass | 18 | Gold | Gold | 10 Áin | 0.25 çm | 0.1 " | 2.54 mm | Beryllium Copper | Through Hole | Wire Wrap | 0.1 in | 2.54 mm | Polyamide (PA46) Nylon 4/6 Glass Filled | -55 C | 125 °C | Open Frame | 0.76 Ám | 30 Áin | 7.62 mm | 0.3 in | DIP |
Aries Electronics | UL94 V-0 | 3 A | 0.5 in | 12.7 mm | Brass | 18 | Gold | Gold | 10 Áin | 0.25 çm | 0.1 " | 2.54 mm | Beryllium Copper | Through Hole | Wire Wrap | 0.1 in | 2.54 mm | Polyamide (PA46) Nylon 4/6 Glass Filled | -55 C | 125 °C | Open Frame | 0.76 Ám | 30 Áin | 7.62 mm | 0.3 in | DIP |
Aries Electronics | UL94 V-0 | 3 A | 0.36 in | 9.14 mm | Brass | 18 | Gold | Tin | 200 µin | 5.08 µm | 0.1 " | 2.54 mm | Beryllium Copper | Through Hole | Wire Wrap | 0.1 in | 2.54 mm | Polyamide (PA46) Nylon 4/6 Glass Filled | -55 C | 105 ░C | Open Frame | 0.76 Ám | 30 Áin | 7.62 mm | 0.3 in | DIP |
Aries Electronics | UL94 V-0 | 3 A | 0.5 in | 12.7 mm | Brass | 18 | Gold | Gold | 10 Áin | 0.25 çm | 0.1 " | 2.54 mm | Beryllium Copper | Through Hole | Wire Wrap | 0.1 in | 2.54 mm | Polyamide (PA46) Nylon 4/6 Glass Filled | -55 C | 125 °C | Open Frame | 0.76 Ám | 30 Áin | 7.62 mm | 0.3 in | DIP |