30-9503 Series
Manufacturer: Aries Electronics
CONN IC DIP SOCKET 30POS GOLD
| Part | Material Flammability Rating | Current Rating (Amps) | Termination Post Length | Termination Post Length | Contact Material - Mating | Pitch - Mating | Pitch - Mating | Operating Temperature [Min] | Operating Temperature [Max] | Number of Positions or Pins (Grid) | Number of Positions or Pins (Grid) [custom] | Number of Positions or Pins (Grid) [custom] | Features | Termination | Pitch - Post | Pitch - Post | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Mounting Type | Housing Material | Contact Material - Post | Contact Finish - Mating | Contact Finish - Post | Type | Type | Type | Contact Finish Thickness - Post | Contact Finish Thickness - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | UL94 V-0 | 3 A | 0.5 in | 12.7 mm | Beryllium Copper | 0.1 " | 2.54 mm | -55 C | 105 ░C | 30 | 15 | 2 | Closed Frame | Wire Wrap | 0.1 in | 2.54 mm | 0.25 µm | 10 µin | Through Hole | Polyamide (PA46) Nylon 4/6 Glass Filled | Phosphor Bronze | Gold | Tin | DIP | 22.86 mm | 0.9 in | 200 µin | 5.08 µm |
Aries Electronics | UL94 V-0 | 3 A | 0.36 in | 9.14 mm | Beryllium Copper | 0.1 " | 2.54 mm | -55 C | 105 ░C | 30 | 15 | 2 | Closed Frame | Wire Wrap | 0.1 in | 2.54 mm | 0.25 µm | 10 µin | Through Hole | Polyamide (PA46) Nylon 4/6 Glass Filled | Phosphor Bronze | Gold | Tin | DIP | 22.86 mm | 0.9 in | 200 µin | 5.08 µm |