36-6575 Series

Catalog

CONN IC DIP SOCKET ZIF 36POS TIN

Part	Termination Post Length	Termination Post Length	Material Flammability Rating	Current Rating (Amps)	Pitch - Post	Pitch - Post	Contact Material - Post	Contact Finish - Post	Mounting Type	Termination	Features	Type	Type	Pitch - Mating	Pitch - Mating	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Number of Positions or Pins (Grid)	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Housing Material
Aries Electronics 36-6575-11	0.11 in	2.78 mm	UL94 V-0	1 A	0.1 in	2.54 mm	Beryllium Copper	Tin	Through Hole	Solder	Closed Frame	DIP ZIF (ZIP)	0.6 " (15.24mm) Row Spacing	0.1 "	2.54 mm	5.08 µm	200 µin	Beryllium Copper	36	200 µin	5.08 µm	Polyphenylene Sulfide (PPS) Glass Filled
Aries Electronics 36-6575-16	0.11 in	2.78 mm	UL94 V-0	1 A	0.1 in	2.54 mm	Beryllium Copper	Tin	Through Hole	Solder	Closed Frame	DIP ZIF (ZIP)	0.6 " (15.24mm) Row Spacing	0.1 "	2.54 mm	5.08 µm	200 µin	Beryllium Copper	36	200 µin	5.08 µm	Polyphenylene Sulfide (PPS) Glass Filled
Aries Electronics 36-6575-10	0.11 in	2.78 mm	UL94 V-0	1 A	0.1 in	2.54 mm	Beryllium Copper	Tin	Through Hole	Solder	Closed Frame	DIP ZIF (ZIP)	0.6 " (15.24mm) Row Spacing	0.1 "	2.54 mm	5.08 µm	200 µin	Beryllium Copper	36	200 µin	5.08 µm	Polyphenylene Sulfide (PPS) Glass Filled