24-6571 Series

Catalog

CONN IC DIP SOCKET ZIF 24POS GLD

Part	Material Flammability Rating	Termination Post Length	Termination Post Length	Current Rating (Amps)	Type	Type	Housing Material	Pitch - Post	Pitch - Post	Termination	Contact Material - Mating	Contact Finish - Mating	Number of Positions or Pins (Grid) [x]	Number of Positions or Pins (Grid) [y]	Number of Positions or Pins (Grid)	Contact Finish - Post	Features	Contact Material - Post	Pitch - Mating	Pitch - Mating	Mounting Type	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Finish Thickness - Post	Contact Finish Thickness - Post
Aries Electronics 24-6571-11	UL94 V-0	0.11 in	2.78 mm	1 A	DIP ZIF (ZIP)	0.6 " (15.24mm) Row Spacing	Polyphenylene Sulfide (PPS) Glass Filled	0.1 in	2.54 mm	Solder	Beryllium Copper	Gold	12	2	24	Gold	Closed Frame	Beryllium Copper	0.1 "	2.54 mm	Through Hole	0.25 µm	10 µin	10 Áin	0.25 çm
Aries Electronics 24-6571-16	UL94 V-0	0.11 in	2.78 mm	1 A	DIP ZIF (ZIP)	0.6 " (15.24mm) Row Spacing	Polyphenylene Sulfide (PPS) Glass Filled	0.1 in	2.54 mm	Solder	Beryllium Nickel	Nickel Boron	12	2	24	Nickel Boron	Closed Frame	Beryllium Nickel	0.1 "	2.54 mm	Through Hole	1.27 µm	50 µin	50 µin	1.27 µm
Aries Electronics 24-6571-10	UL94 V-0	0.11 in	2.78 mm	1 A	DIP ZIF (ZIP)	0.6 " (15.24mm) Row Spacing	Polyphenylene Sulfide (PPS) Glass Filled	0.1 in	2.54 mm	Solder	Beryllium Copper		12	2	24	Tin	Closed Frame	Beryllium Copper	0.1 "	2.54 mm	Through Hole	5.08 µm	200 µin	200 µin	5.08 µm