30-1508 Series

Catalog

CONN IC DIP SOCKET 30POS GOLD

Part	Current Rating (Amps)	Material Flammability Rating	Termination Post Length	Termination Post Length	Contact Material - Mating	Pitch - Mating	Pitch - Mating	Contact Material - Post [custom]	Mounting Type	Contact Finish - Post	Features	Termination	Number of Positions or Pins (Grid)	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]	Type	Type	Contact Finish - Mating	Housing Material	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Operating Temperature [Min]	Operating Temperature [Max]	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Pitch - Post	Pitch - Post
Aries Electronics 30-1508-20	3 A	UL94 V-0	9.14 mm	0.36 in	Beryllium Copper	0.1 "	2.54 mm	Brass	Through Hole	Tin	Closed Frame	Wire Wrap	30	15	2	DIP	5.08 mm	Gold	Polyamide (PA46) Nylon 4/6	200 µin	5.08 µm	-55 C	105 ░C	0.25 µm	10 µin	0.1 in	2.54 mm
Aries Electronics 30-1508-30	3 A	UL94 V-0	12.7 mm	0.5 in	Beryllium Copper	0.1 "	2.54 mm	Brass	Through Hole	Tin	Closed Frame	Wire Wrap	30	15	2	DIP	5.08 mm	Gold	Polyamide (PA46) Nylon 4/6	200 µin	5.08 µm	-55 C	105 ░C	0.25 µm	10 µin	0.1 in	2.54 mm
Aries Electronics 30-1508-31	3 A	UL94 V-0	12.7 mm	0.5 in	Beryllium Copper	0.1 "	2.54 mm	Brass	Through Hole	Gold	Closed Frame	Wire Wrap	30	15	2	DIP	5.08 mm	Gold	Polyamide (PA46) Nylon 4/6	10 Áin	0.25 çm	-55 C	125 °C	0.25 µm	10 µin	0.1 in	2.54 mm
Aries Electronics 30-1508-21	3 A	UL94 V-0	9.14 mm	0.36 in	Beryllium Copper	0.1 "	2.54 mm	Brass	Through Hole	Gold	Closed Frame	Wire Wrap	30	15	2	DIP	5.08 mm	Gold	Polyamide (PA46) Nylon 4/6	10 Áin	0.25 çm	-55 C	125 °C	0.25 µm	10 µin	0.1 in	2.54 mm